Issued Patents All Time
Showing 51–75 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053329 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Gaius Gillman Fountain, Jr. | 2011-11-08 |
| 7956447 | Wafer scale die handling | Gaius Gillman Fountain, Jr., Carl T. Petteway | 2011-06-07 |
| 7871898 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Gaius Gillman Fountain, Jr. | 2011-01-18 |
| 7842540 | Room temperature metal direct bonding | Qin-Yi Tong, Anthony Scot Rose | 2010-11-30 |
| 7807549 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Gaius Gillman Fountain, Jr. | 2010-10-05 |
| 7714446 | Single mask via method and device | — | 2010-05-11 |
| 7622324 | Wafer bonding hermetic encapsulation | Qin-Yi Tong, Gaius Gillman Fountain, Jr., Robert J. Markunas | 2009-11-24 |
| 7602070 | Room temperature metal direct bonding | Qin-Yi Tong, Anthony Scot Rose | 2009-10-13 |
| 7553744 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Gaius Gillman Fountain, Jr. | 2009-06-30 |
| 7485968 | 3D IC method and device | Gaius Gillman Fountain, Jr., Qin-Yi Tong | 2009-02-03 |
| 7387944 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Gaius Gillman Fountain, Jr. | 2008-06-17 |
| 7341938 | Single mask via method and device | — | 2008-03-11 |
| 7335572 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Gaius Gillman Fountain, Jr. | 2008-02-26 |
| 7126212 | Three dimensional device integration method and integrated device | Gaius Gillman Fountain, Jr. | 2006-10-24 |
| 7041178 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Gaius Gillman Fountain, Jr. | 2006-05-09 |
| 7037755 | Three dimensional device integration method and integrated device | — | 2006-05-02 |
| 6984571 | Three dimensional device integration method and integrated device | — | 2006-01-10 |
| 6962835 | Method for room temperature metal direct bonding | Qin-Yi Tong, Anthony Scot Rose | 2005-11-08 |
| 6905557 | Three dimensional integrated device | — | 2005-06-14 |
| 6902987 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Gaius Gillman Fountain, Jr. | 2005-06-07 |
| 6867073 | Single mask via method and device | — | 2005-03-15 |
| 6864585 | Three dimensional device integration method and integrated device | — | 2005-03-08 |
| 6822326 | Wafer bonding hermetic encapsulation | Qin-Yi Tong, Gaius Gillman Fountain, Jr., Robert J. Markunas | 2004-11-23 |
| 6756281 | Self aligned symmetric intrinsic process and device | — | 2004-06-29 |
| 6740909 | Self aligned symmetric intrinsic process and device | — | 2004-05-25 |