Issued Patents All Time
Showing 26–50 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366962 | Three dimensional device integration method and integrated device | Gaius Gillman Fountain, Jr. | 2019-07-30 |
| 10312217 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Gaius Gillman Fountain, Jr. | 2019-06-04 |
| 10269708 | Increased contact alignment tolerance for direct bonding | Gaius Gillman Fountain, Jr., Javier A. Delacruz | 2019-04-23 |
| 10262963 | Conductive barrier direct hybrid bonding | — | 2019-04-16 |
| 10204893 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Arkalgud R. Sitaram | 2019-02-12 |
| 10147641 | 3D IC method and device | Gaius Gillman Fountain, Jr., Qin-Yi Tong | 2018-12-04 |
| 10141218 | Room temperature metal direct bonding | Qin-Yi Tong, Anthony Scot Rose | 2018-11-27 |
| 9953941 | Conductive barrier direct hybrid bonding | — | 2018-04-24 |
| 9852988 | Increased contact alignment tolerance for direct bonding | Gaius Gillman Fountain, Jr., Javier A. Delacruz | 2017-12-26 |
| 9716033 | 3D IC method and device | Gaius Gillman Fountain, Jr., Qin-Yi Tong | 2017-07-25 |
| 9698126 | Heterogeneous annealing method and device | Gaius Gillman Fountain, Jr. | 2017-07-04 |
| 9564414 | Three dimensional device integration method and integrated device | Gaius Gillman Fountain, Jr. | 2017-02-07 |
| 9431368 | Three dimensional device integration method and integrated device | Gaius Gillman Fountain, Jr. | 2016-08-30 |
| 9391143 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Gaius Gillman Fountain, Jr. | 2016-07-12 |
| 9385024 | Room temperature metal direct bonding | Qin-Yi Tong, Anthony Scot Rose | 2016-07-05 |
| 9331149 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Gaius Gillman Fountain, Jr. | 2016-05-03 |
| 9184125 | Heterogeneous annealing method and device | Gaius Gillman Fountain, Jr. | 2015-11-10 |
| 9171756 | 3D IC method and device | Gaius Gillman Fountain, Jr., Qin-Yi Tong | 2015-10-27 |
| 9082627 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Gaius Gillman Fountain, Jr. | 2015-07-14 |
| 8846450 | Room temperature metal direct bonding | Qin-Yi Tong, Anthony Scott Rose | 2014-09-30 |
| 8735219 | Heterogeneous annealing method and device | Gaius Gillman Fountain, Jr. | 2014-05-27 |
| 8709938 | 3D IC method and device | Gaius Gillman Fountain, Jr., Qin-Yi Tong | 2014-04-29 |
| 8524533 | Room temperature metal direct bonding | Qin-Yi Tong, Anthony Scot Rose | 2013-09-03 |
| 8389378 | 3D IC method and device | Gaius Gillman Fountain, Jr., Qin-Yi Tong | 2013-03-05 |
| 8153505 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Gaius Gillman Fountain, Jr. | 2012-04-10 |