Issued Patents All Time
Showing 126–143 of 143 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269708 | Increased contact alignment tolerance for direct bonding | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2019-04-23 |
| 10149377 | Stacked transmission line | Shaowu Huang, Belgacem Haba | 2018-12-04 |
| 10050003 | Elongated pad structure | — | 2018-08-14 |
| 10018670 | Wireless probes | — | 2018-07-10 |
| 10002844 | Bonded structures | Liang Wang, Rajesh Katkar, Arkalgud R. Sitaram | 2018-06-19 |
| 9984992 | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces | Abiola Awujoola, Ashok S. Prabhu, Christopher W. Lattin, Zhuowen Sun | 2018-05-29 |
| 9984997 | Communication interface architecture using serializer/deserializer | — | 2018-05-29 |
| 9972582 | Warpage balancing in thin packages | Belgacem Haba, Sangil Lee, Craig Mitchell, Gabriel Z. Guevara | 2018-05-15 |
| 9935075 | Wire bonding method and apparatus for electromagnetic interference shielding | Shaowu Huang | 2018-04-03 |
| 9859257 | Flipped die stacks with multiple rows of leadframe interconnects | Belgacem Haba, Tu Tam Vu, Rajesh Katkar | 2018-01-02 |
| 9852988 | Increased contact alignment tolerance for direct bonding | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2017-12-26 |
| 9659848 | Stiffened wires for offset BVA | Grant Villavicencio, Sangil Lee, Roseann Alatorre, Scott McGrath | 2017-05-23 |
| 9595511 | Microelectronic packages and assemblies with improved flyby signaling operation | Belgacem Haba, Zhuowen Sun | 2017-03-14 |
| 9508691 | Flipped die stacks with multiple rows of leadframe interconnects | Belgacem Haba, Tu Tam Vu, Rajesh Katkar | 2016-11-29 |
| 9461000 | Parallel signal via structure | — | 2016-10-04 |
| 9435846 | Testing of thru-silicon vias | — | 2016-09-06 |
| 9263409 | Mixed-sized pillars that are probeable and routable | — | 2016-02-16 |
| 6051871 | Heterojunction bipolar transistor having improved heat dissipation | Xiangdong Zhang, Matthew Francis O'Keefe, Gregory Henderson, Yong-Hoon Yun | 2000-04-18 |