Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057383 | Bonded structures with integrated passive component | Belgacem Haba, Ilyas Mohammed, Rajesh Katkar, Gabriel Z. Guevara, Javier A. Delacruz +1 more | 2024-08-06 |
| 10892252 | Face-to-face mounted IC dies with orthogonal top interconnect layers | Eric Nequist, Steven Teig, Javier A. Delacruz, Ilyas Mohammed | 2021-01-12 |
| 10580757 | Face-to-face mounted IC dies with orthogonal top interconnect layers | Eric Nequist, Steven Teig, Javier A. Delacruz, Ilyas Mohammed | 2020-03-03 |