Issued Patents All Time
Showing 26–50 of 143 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11916076 | Device disaggregation for improved performance | Don Draper, Jung Ko, Steven Teig | 2024-02-27 |
| 11901281 | Bonded structures with integrated passive component | Belgacem Haba | 2024-02-13 |
| 11894345 | Integrated voltage regulator and passive components | Don Draper, Belgacem Haba, Ilyas Mohammed | 2024-02-06 |
| 11881454 | Stacked IC structure with orthogonal interconnect layers | Ilyas Mohammed, Steven Teig | 2024-01-23 |
| 11876076 | Apparatus for non-volatile random access memory stacks | Belgacem Haba, Rajesh Katkar, Pearl Po-Yee Cheng | 2024-01-16 |
| 11862604 | Systems and methods for releveled bump planes for chiplets | Belgacem Haba, Cyprian Emeka Uzoh, Rajesh Katkar, Ilyas Mohammed | 2024-01-02 |
| 11862602 | Scalable architecture for reduced cycles across SOC | Richard E. Perego | 2024-01-02 |
| 11860415 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Shaowu Huang, Liang Wang, Guilian Gao | 2024-01-02 |
| 11848284 | Protective elements for bonded structures | Belgacem Haba, Rajesh Katkar | 2023-12-19 |
| 11837556 | Wire bonding method and apparatus for electromagnetic interference shielding | Shaowu Huang | 2023-12-05 |
| 11830804 | Over and under interconnects | Belgacem Haba, Stephen L. Morein, Ilyas Mohammed, Rajesh Katkar | 2023-11-28 |
| 11824046 | Symbiotic network on layers | Belgacem Haba, Rajesh Katkar | 2023-11-21 |
| 11824042 | 3D chip sharing data bus | Steven Teig, Ilyas Mohammed | 2023-11-21 |
| 11823906 | Direct-bonded native interconnects and active base die | Steven Teig, Shaowu Huang, William C. Plants, David Edward Fisch | 2023-11-21 |
| 11817409 | Directly bonded structures without intervening adhesive and methods for forming the same | Belgacem Haba, Rajesh Katkar, Ilyas Mohammed | 2023-11-14 |
| 11804469 | Active bridging apparatus | Belgacem Haba, Rajesh Katkar | 2023-10-31 |
| 11728287 | Wafer-level bonding of obstructive elements | Rajesh Katkar | 2023-08-15 |
| 11721653 | Circuitry for electrical redundancy in bonded structures | Belgacem Haba, Jung Ko | 2023-08-08 |
| 11688776 | Transistor level interconnection methodologies utilizing 3D interconnects | David Edward Fisch | 2023-06-27 |
| 11670615 | Bonded structures | Liang Wang, Rajesh Katkar, Arkalgud R. Sitaram | 2023-06-06 |
| 11626363 | Bonded structures with integrated passive component | Belgacem Haba, Ilyas Mohammed, Rajesh Katkar, Gabriel Z. Guevara, Shaowu Huang +1 more | 2023-04-11 |
| 11610846 | Protective elements for bonded structures including an obstructive element | Belgacem Haba, Rajesh Katkar, Arkalgud R. Sitaram | 2023-03-21 |
| 11599299 | 3D memory circuit | David Edward Fisch | 2023-03-07 |
| 11600542 | Cavity packages | Shaowu Huang, Liang Wang, Rajesh Katkar, Belgacem Haba | 2023-03-07 |
| 11557516 | 3D chip with shared clock distribution network | Steven Teig, Ilyas Mohammed, Eric Nequist | 2023-01-17 |