Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728524 | Enhanced density assembly having microelectronic packages mounted at substantial angle to board | Min Tao, Hoki Kim, Wael Zohni, Akash Agrawal | 2017-08-08 |
| 9691702 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Liang Wang +1 more | 2017-06-27 |
| 9691437 | Compact microelectronic assembly having reduced spacing between controller and memory packages | Yong-Syuan Chen | 2017-06-27 |
| 9679613 | TFD I/O partition for high-speed, high-density applications | Kyong-Mo Bang, Belgacem Haba, Wael Zohni | 2017-06-13 |
| 9666521 | Ultra high performance interposer | Cyprian Emeka Uzoh | 2017-05-30 |
| 9640282 | Flexible I/O partition of multi-die memory solution | Yong-Syuan Chen | 2017-05-02 |
| 9640236 | Reduced load memory module using wire bonds and a plurality of rank signals | Yong-Syuan Chen | 2017-05-02 |
| 9595511 | Microelectronic packages and assemblies with improved flyby signaling operation | Belgacem Haba, Javier A. Delacruz | 2017-03-14 |
| 9583417 | Via structure for signal equalization | Cyprian Emeka Uzoh, Yong-Syuan Chen | 2017-02-28 |
| 9490222 | Wire bond wires for interference shielding | Abiola Awujoola, Wael Zohni, Ashok S. Prabhu, Willmar Subido | 2016-11-08 |
| 9484080 | High-bandwidth memory application with controlled impedance loading | Yong-Syuan Chen, Kyong-Mo Bang | 2016-11-01 |
| 9460758 | Single package dual channel memory with co-support | Richard Dewitt Crisp, Yong-Syuan Chen, Belgacem Haba, Wael Zohni | 2016-10-04 |
| 9402312 | Circuit assemblies with multiple interposer substrates, and methods of fabrication | Hong Shen, Charles G. Woychik, Arkalgud R. Sitaram | 2016-07-26 |
| 9397038 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Liang Wang +1 more | 2016-07-19 |
| 9349707 | Contact arrangements for stackable microelectronic package structures with multiple ranks | Yong-Syuan Chen, Kyong-Mo Bang | 2016-05-24 |
| 9343398 | BGA ballout partition techniques for simplified layout in motherboard with multiple power supply rail | Yong-Syuan Chen, Kyong-Mo Bang | 2016-05-17 |
| 9337170 | Contact arrangements for stackable microelectronic package structures | Yong-Syuan Chen, Kyong-Mo Bang | 2016-05-10 |
| 9281296 | Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design | Yong-Syuan Chen, Kyong-Mo Bang | 2016-03-08 |
| 9070423 | Single package dual channel memory with co-support | Richard Dewitt Crisp, Yong-Syuan Chen, Belgacem Haba, Wael Zohni | 2015-06-30 |
| 8358193 | Planar inductor devices | Sidharth Dalmia, Shanit Vannala, Steven R. Kubes | 2013-01-22 |