Issued Patents All Time
Showing 26–50 of 147 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9905502 | Sintered conductive matrix material on wire bond | — | 2018-02-27 |
| 9893033 | Off substrate kinking of bond wire | Belgacem Haba, Reynaldo Co, Rizza Lee Saga Cizek | 2018-02-13 |
| 9888579 | Pressing of wire bond wire tips to provide bent-over tips | Reynaldo Co, Grant Villavicencio | 2018-02-06 |
| 9812402 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Ashok S. Prabhu, Willmar Subido | 2017-11-07 |
| 9806017 | Flip-chip, face-up and face-down centerbond memory wirebond assemblies | Belgacem Haba, Richard Dewitt Crisp | 2017-10-31 |
| 9761554 | Ball bonding metal wire bond wires to metal pads | Willmar Subido, Reynaldo Co, Ashok S. Prabhu | 2017-09-12 |
| 9735093 | Stacked chip-on-board module with edge connector | Belgacem Haba | 2017-08-15 |
| 9735084 | Bond via array for thermal conductivity | Rajesh Katkar, Guilian Gao, Charles G. Woychik | 2017-08-15 |
| 9728524 | Enhanced density assembly having microelectronic packages mounted at substantial angle to board | Min Tao, Zhuowen Sun, Hoki Kim, Akash Agrawal | 2017-08-08 |
| 9728495 | Reconfigurable PoP | Belgacem Haba, Richard Dewitt Crisp | 2017-08-08 |
| 9679838 | Stub minimization for assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2017-06-13 |
| 9679613 | TFD I/O partition for high-speed, high-density applications | Zhuowen Sun, Kyong-Mo Bang, Belgacem Haba | 2017-06-13 |
| 9679876 | Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2017-06-13 |
| 9640515 | Multiple die stacking for two or more die | Belgacem Haba | 2017-05-02 |
| 9633975 | Multi-die wirebond packages with elongated windows | Belgacem Haba | 2017-04-25 |
| 9633968 | Microelectronic packages having cavities for receiving microelectronic elements | Ilyas Mohammed, Belgacem Haba, Philip R. Osborn | 2017-04-25 |
| 9530749 | Coupling of side surface contacts to a circuit platform | Reynaldo Co, Willmar Subido, Hoang Linh Nguyen, Marjorie Cara, Christopher W. Lattin | 2016-12-27 |
| 9530458 | Stub minimization using duplicate sets of signal terminals | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2016-12-27 |
| 9515053 | Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2016-12-06 |
| 9508629 | Memory module in a package | Belgacem Haba, Richard Dewitt Crisp, Ilyas Mohammed | 2016-11-29 |
| 9496243 | Microelectronic assembly with opposing microelectronic packages each having terminals with signal assignments that mirror each other with respect to a central axis | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2016-11-15 |
| 9490222 | Wire bond wires for interference shielding | Abiola Awujoola, Zhuowen Sun, Ashok S. Prabhu, Willmar Subido | 2016-11-08 |
| 9466587 | Multiple die in a face down package | Belgacem Haba, Richard Dewitt Crisp | 2016-10-11 |
| 9460758 | Single package dual channel memory with co-support | Richard Dewitt Crisp, Yong-Syuan Chen, Belgacem Haba, Zhuowen Sun | 2016-10-04 |
| 9461015 | Enhanced stacked microelectronic assemblies with central contacts | Belgacem Haba, Richard Dewitt Crisp | 2016-10-04 |