Issued Patents All Time
Showing 76–100 of 147 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9123713 | Lead structures with vertical offsets | Richard Dewitt Crisp, Belgacem Haba | 2015-09-01 |
| 9117811 | Flip chip assembly and process with sintering material on metal bumps | — | 2015-08-25 |
| 9105612 | Microelectronic packages having cavities for receiving microelectronic elements | Ilyas Mohammed, Belgacem Haba, Philip R. Osborn | 2015-08-11 |
| 9093291 | Flip-chip, face-up and face-down wirebond combination package | Belgacem Haba, Richard Dewitt Crisp | 2015-07-28 |
| 9087815 | Off substrate kinking of bond wire | Belgacem Haba, Reynaldo Co, Rizza Lee Saga Cizek | 2015-07-21 |
| 9082753 | Severing bond wire by kinking and twisting | Belgacem Haba, Reynaldo Co, Rizza Lee Saga Cizek | 2015-07-14 |
| 9070423 | Single package dual channel memory with co-support | Richard Dewitt Crisp, Yong-Syuan Chen, Belgacem Haba, Zhuowen Sun | 2015-06-30 |
| 9013033 | Multiple die face-down stacking for two or more die | Belgacem Haba, Richard Dewitt Crisp, Ilyas Mohammed, Frank Lambrecht | 2015-04-21 |
| 9000583 | Multiple die in a face down package | Belgacem Haba, Richard Dewitt Crisp | 2015-04-07 |
| 8994170 | Microelectronic unit and package with positional reversal | Richard Dewitt Crisp, Belgacem Haba | 2015-03-31 |
| 8981547 | Stub minimization for multi-die wirebond assemblies with parallel windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2015-03-17 |
| 8981579 | Impedance controlled packages with metal sheet or 2-layer rdl | Belgacem Haba, Ellis Chau, Philip Damberg, Richard Dewitt Crisp | 2015-03-17 |
| 8970028 | Embedded heat spreader for package with multiple microelectronic elements and face-down connection | — | 2015-03-03 |
| 8952516 | Multiple die stacking for two or more die | Belgacem Haba | 2015-02-10 |
| 8946901 | Microelectronic package and method of manufacture thereof | Chung-Chuan Tseng | 2015-02-03 |
| 8945987 | Manufacture of face-down microelectronic packages | Richard Dewitt Crisp, Belgacem Haba | 2015-02-03 |
| 8941999 | Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics | Belgacem Haba, Richard Dewitt Crisp | 2015-01-27 |
| 8928153 | Flip-chip, face-up and face-down centerbond memory wirebond assemblies | Belgacem Haba, Richard Dewitt Crisp | 2015-01-06 |
| 8917532 | Stub minimization with terminal grids offset from center of package | Richard Dewitt Crisp | 2014-12-23 |
| 8907500 | Multi-die wirebond packages with elongated windows | Belgacem Haba | 2014-12-09 |
| 8885356 | Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution | Belgacem Haba, Richard Dewitt Crisp | 2014-11-11 |
| 8872318 | Through interposer wire bond using low CTE interposer with coarse slot apertures | Simon J. S. McElrea, Belgacem Haba | 2014-10-28 |
| 8848392 | Co-support module and microelectronic assembly | Richard Dewitt Crisp, Belgacem Haba | 2014-09-30 |
| 8848391 | Co-support component and microelectronic assembly | Richard Dewitt Crisp, Belgacem Haba | 2014-09-30 |
| 8823165 | Memory module in a package | Belgacem Haba, Richard Dewitt Crisp, Ilyas Mohammed | 2014-09-02 |