Issued Patents All Time
Showing 101–125 of 147 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8786069 | Reconfigurable pop | Belgacem Haba, Richard Dewitt Crisp | 2014-07-22 |
| 8786083 | Impedance controlled packages with metal sheet or 2-layer RDL | Belgacem Haba, Ellis Chau, Philip Damberg, Richard Dewitt Crisp | 2014-07-22 |
| 8787032 | Enhanced stacked microelectronic assemblies with central contacts | Belgacem Haba, Richard Dewitt Crisp | 2014-07-22 |
| 8787034 | Co-support system and microelectronic assembly | Richard Dewitt Crisp, Belgacem Haba | 2014-07-22 |
| 8759982 | Deskewed multi-die packages | Richard Dewitt Crisp, Belgacem Haba | 2014-06-24 |
| 8730670 | Embossed heat spreader | William L. Schmidt, Michael J. Smith, Jeremy Matthew Plunkett | 2014-05-20 |
| 8723329 | In-package fly-by signaling | Richard Dewitt Crisp, Belgacem Haba, Yong-Syuan Chen | 2014-05-13 |
| 8705240 | Embossed heat spreader | William L. Schmidt, Michael J. Smith, Jeremy Matthew Plunkett | 2014-04-22 |
| 8670261 | Stub minimization using duplicate sets of signal terminals | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2014-03-11 |
| 8659143 | Stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2014-02-25 |
| 8659142 | Stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2014-02-25 |
| 8659141 | Stub minimization using duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2014-02-25 |
| 8659140 | Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2014-02-25 |
| 8659139 | Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2014-02-25 |
| 8653646 | Stub minimization using duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2014-02-18 |
| 8633576 | Stacked chip-on-board module with edge connector | Belgacem Haba | 2014-01-21 |
| 8629545 | Stub minimization for assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2014-01-14 |
| 8610260 | Stub minimization for assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2013-12-17 |
| 8569884 | Multiple die in a face down package | Belgacem Haba, Richard Dewitt Crisp | 2013-10-29 |
| 8553420 | Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics | Belgacem Haba, Richard Dewitt Crisp | 2013-10-08 |
| 8541873 | Microelectronic packages having cavities for receiving microelectronic elements | Ilyas Mohammed, Belgacem Haba, Philip R. Osborn | 2013-09-24 |
| 8525327 | Stub minimization for assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2013-09-03 |
| 8513813 | Stub minimization using duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2013-08-20 |
| 8513817 | Memory module in a package | Belgacem Haba, Richard Dewitt Crisp, Ilyas Mohammed | 2013-08-20 |
| 8502390 | De-skewed multi-die packages | Richard Dewitt Crisp, Belgacem Haba | 2013-08-06 |