Issued Patents All Time
Showing 51–75 of 147 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9443822 | Flip chip assembly and process with sintering material on metal bumps | — | 2016-09-13 |
| 9437579 | Multiple die face-down stacking for two or more die | Belgacem Haba, Richard Dewitt Crisp, Ilyas Mohammed, Frank Lambrecht | 2016-09-06 |
| 9423824 | Stub minimization for multi-die wirebond assemblies with parallel windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2016-08-23 |
| 9412714 | Wire bond support structure and microelectronic package including wire bonds therefrom | Reynaldo Co, Rizza Lee Saga Cizek, Rajesh Katkar | 2016-08-09 |
| 9377824 | Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2016-06-28 |
| 9373565 | Stub minimization for assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2016-06-21 |
| 9368477 | Co-support circuit panel and microelectronic packages | Richard Dewitt Crisp, Belgacem Haba | 2016-06-14 |
| 9368478 | Microelectronic package and method of manufacture thereof | Chung-Chuan Tseng | 2016-06-14 |
| 9355996 | Microelectronic package with consolidated chip structures | Belgacem Haba, Richard Dewitt Crisp, Ilyas Mohammed | 2016-05-31 |
| 9318467 | Multi-die wirebond packages with elongated windows | Belgacem Haba | 2016-04-19 |
| 9312239 | Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics | Belgacem Haba, Richard Dewitt Crisp | 2016-04-12 |
| 9312244 | Multiple die stacking for two or more die | Belgacem Haba | 2016-04-12 |
| 9293444 | Co-support for XFD packaging | Richard Dewitt Crisp, Belgacem Haba | 2016-03-22 |
| 9287216 | Memory module in a package | Belgacem Haba, Richard Dewitt Crisp, Ilyas Mohammed | 2016-03-15 |
| 9287195 | Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2016-03-15 |
| 9281266 | Stacked chip-on-board module with edge connector | Belgacem Haba | 2016-03-08 |
| 9281295 | Embedded heat spreader for package with multiple microelectronic elements and face-down connection | — | 2016-03-08 |
| 9281271 | Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2016-03-08 |
| 9241420 | In-package fly-by signaling | Richard Dewitt Crisp, Belgacem Haba, Yong-Syuan Chen | 2016-01-19 |
| 9224431 | Stub minimization using duplicate sets of signal terminals | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2015-12-29 |
| 9219050 | Microelectronic unit and package with positional reversal | Richard Dewitt Crisp, Belgacem Haba | 2015-12-22 |
| 9214455 | Stub minimization with terminal grids offset from center of package | Richard Dewitt Crisp | 2015-12-15 |
| 9136197 | Impedence controlled packages with metal sheet or 2-layer RDL | Belgacem Haba, Ellis Chau, Philip Damberg, Richard Dewitt Crisp | 2015-09-15 |
| 9123555 | Co-support for XFD packaging | Richard Dewitt Crisp, Belgacem Haba | 2015-09-01 |
| 9123600 | Microelectronic package with consolidated chip structures | Belgacem Haba, Richard Dewitt Crisp, Ilyas Mohammed | 2015-09-01 |