Issued Patents All Time
Showing 126–147 of 147 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8466564 | Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution | Belgacem Haba, Richard Dewitt Crisp | 2013-06-18 |
| 8441111 | Stub minimization for multi-die wirebond assemblies with parallel windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2013-05-14 |
| 8436477 | Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2013-05-07 |
| 8436458 | Flip-chip, face-up and face-down wirebond combination package | Belgacem Haba, Richard Dewitt Crisp | 2013-05-07 |
| 8436457 | Stub minimization for multi-die wirebond assemblies with parallel windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2013-05-07 |
| 8405207 | Stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2013-03-26 |
| 8378478 | Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts | Kishor Desai, Belgacem Haba | 2013-02-19 |
| 8345441 | Stub minimization for multi-die wirebond assemblies with parallel windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2013-01-01 |
| 8338963 | Multiple die face-down stacking for two or more die | Belgacem Haba, Richard Dewitt Crisp, Ilyas Mohammed | 2012-12-25 |
| 8304881 | Flip-chip, face-up and face-down wirebond combination package | Belgacem Haba, Richard Dewitt Crisp | 2012-11-06 |
| 8278764 | Stub minimization for multi-die wirebond assemblies with orthogonal windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2012-10-02 |
| 8254155 | Stub minimization for multi-die wirebond assemblies with orthogonal windows | Richard Dewitt Crisp, Belgacem Haba, Frank Lambrecht | 2012-08-28 |
| 8222725 | Metal can impedance control structure | Belgacem Haba, Ellis Chau, Richard Dewitt Crisp | 2012-07-17 |
| 8080874 | Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween | Jeremy Werner, Daniel L. Rosenband, Jeremy Matthew Plunkett, William L. Schmidt, David T. Wang +4 more | 2011-12-20 |
| 8081474 | Embossed heat spreader | William L. Schmidt, Michael J. Smith, Jeremy Matthew Plunkett | 2011-12-20 |
| 7994622 | Microelectronic packages having cavities for receiving microelectric elements | Ilyas Mohammed, Belgacem Haba, Philip R. Osborn | 2011-08-09 |
| 7554206 | Microelectronic packages and methods therefor | Belgacem Haba, Masud Beroz, Ronald Green, Ilyas Mohammed, Stuart E. Wilson +2 more | 2009-06-30 |
| 7335995 | Microelectronic assembly having array including passive elements and interconnects | L. Pflughaupt, David Gibson, Young Gon Kim, Craig Mitchell, Ilyas Mohammed | 2008-02-26 |
| 7176043 | Microelectronic packages and methods therefor | Belgacem Haba, Masud Beroz, Ronald Green, Ilyas Mohammed, Stuart E. Wilson +2 more | 2007-02-13 |
| 6977440 | Stacked packages | L. Pflughaupt, David Gibson, Young Gon Kim, Craig Mitchell, Ilyas Mohammed | 2005-12-20 |
| 6870267 | Off-center solder ball attach assembly | — | 2005-03-22 |
| 6380060 | Off-center solder ball attach and methods therefor | — | 2002-04-30 |