Issued Patents All Time
Showing 51–75 of 154 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7750333 | Bit-erasing architecture for seek-scan probe (SSP) memory storage | Valluri Rao, Tsung-Kuan A. Chou | 2010-07-06 |
| 7695681 | Miniature chemical analysis system | Li-Peng Wang | 2010-04-13 |
| 7626846 | Method and media for improving ferroelectric domain stability in an information storage device | Valluri Rao, Li-Peng Wang, Byong-man Kim | 2009-12-01 |
| 7559242 | Silicon micromachined ultra-sensitive vibration spectrum sensor array (VSSA) | Li-Peng Wang, Valluri Rao, Goutam Paul | 2009-07-14 |
| 7510907 | Through-wafer vias and surface metallization for coupling thereto | John Heck, Quan Tran, Tsung-Kuan A. Chou, Semeon Altshuler, Boaz Weinfeld | 2009-03-31 |
| 7416918 | Direct build-up layer on an encapsulated die package having a moisture barrier structure | — | 2008-08-26 |
| 7410858 | Isolation structure configurations for modifying stresses in semiconductor devices | Jin Lee, Harry Fujimoto, Changhong Dai, Shiuh-Wuu Lee, Travis Eiles +1 more | 2008-08-12 |
| 7411269 | Isolation structure configurations for modifying stresses in semiconductor devices | Jin Lee, Harry Fujimoto, Changhong Dai, Shiuh-Wuu Lee, Travis Eiles +1 more | 2008-08-12 |
| 7410763 | Multiplex data collection and analysis in bioanalyte detection | Xing Su, Lei Sun, Mineo Yamakawa, Jingwu Zhang, Tae-Woong Koo +1 more | 2008-08-12 |
| 7358579 | Reducing the actuation voltage of microelectromechanical system switches | Tsung-Kuan A. Chou, Valluri Rao | 2008-04-15 |
| 7358615 | Microelectronic package having multiple conductive paths through an opening in a support substrate | John Heck | 2008-04-15 |
| 7358580 | Sacrificial layer technique to make gaps in MEMS applications | Peng Cheng | 2008-04-15 |
| 7348928 | Slot antenna having a MEMS varactor for resonance frequency tuning | Xintian E. Lin, Al Bettner | 2008-03-25 |
| 7332061 | Integration of multiple frequency band FBAR filters | Li-Peng Wang | 2008-02-19 |
| 7321275 | Ultra-low voltage capable zipper switch | Tsung-Kuan A. Chou, Hanan Bar, Quan Tran, Joseph Melki, John Heck | 2008-01-22 |
| 7291561 | MEMS device integrated chip package, and method of making same | Peng Cheng, Valluri Rao | 2007-11-06 |
| 7245057 | Micro-electromechanical structure resonator frequency adjustment using radiant energy trimming and laser/focused ion beam assisted deposition | Peng Cheng, Valluri Rao | 2007-07-17 |
| 7218188 | Microelectromechanical apparatus and methods for surface acoustic wave switching | Dong-sik Shim | 2007-05-15 |
| 7189596 | Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures | Chun Mu, Quat Vu, Steven Towle | 2007-03-13 |
| 7183622 | Module integrating MEMS and passive components | John Heck, Eyal Bar-Sadeh | 2007-02-27 |
| 7173203 | Integrated microsprings for speed switches | — | 2007-02-06 |
| 7154358 | Film bulk acoustic resonator structure and method of making | Li-Peng Wang, Valluri Rao | 2006-12-26 |
| 7152289 | Method for forming bulk resonators silicon <110> substrate | Li-Peng Wang, Israel Yankovich | 2006-12-26 |
| 7030432 | Method of fabricating an integrated circuit that seals a MEMS device within a cavity | — | 2006-04-18 |
| 7026562 | Protected switch and techniques to manufacture the same | Yuegang Zhang | 2006-04-11 |