Issued Patents All Time
Showing 76–100 of 154 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7005314 | Sacrificial layer technique to make gaps in MEMS applications | Peng Cheng | 2006-02-28 |
| 7002436 | Vacuum-cavity MEMS resonator | Peng Cheng, Valluri Rao | 2006-02-21 |
| 6995440 | MEMS switch having hexsil beam and method of integrating MEMS switch with a chip | — | 2006-02-07 |
| 6980412 | Variable tunable range MEMS capacitor | Peng Cheng | 2005-12-27 |
| 6975184 | Adjusting the frequency of film bulk acoustic resonators | Li-Peng Wang, Michael DiBattista, Seth A. Fortuna, Valluri Rao | 2005-12-13 |
| 6972650 | System that includes an electrode configuration in a MEMS switch | — | 2005-12-06 |
| 6967548 | Microelectromechanical (MEMS) switching apparatus | Valluri Rao, John Heck, Li-Peng Wang, Dong-sik Shim, Quan Tran | 2005-11-22 |
| 6964889 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Xiao-Chun Mu, Quat Vu | 2005-11-15 |
| 6954020 | Apparatus for adjusting the resonance frequency of a microelectromechanical (MEMS) resonator using tensile/compressive strain and applications thereof | Andy Berlin | 2005-10-11 |
| 6949268 | Frequency uniformity of film bulk acoustic resonators | Li-Peng Wang, Dong-sik Shim | 2005-09-27 |
| 6943648 | Methods for forming a frequency bulk acoustic resonator with uniform frequency utilizing multiple trimming layers and structures formed thereby | Jose Maiz, Li-Peng Wang, Valluri Rao | 2005-09-13 |
| 6940363 | Switch architecture using MEMS switches and solid state switches in parallel | Eliav Zipper | 2005-09-06 |
| 6940367 | Forming film bulk acoustic resonator filters | Li-Peng Wang, Valluri Rao | 2005-09-06 |
| 6936780 | Protected switch and techniques to manufacture the same | Yuegang Zhang | 2005-08-30 |
| 6933808 | Microelectromechanical apparatus and methods for surface acoustic wave switching | Dong-sik Shim | 2005-08-23 |
| 6914335 | Semiconductor device having a low-K dielectric layer | Ebrahim Andideh, Quan Tran, Steve Towle | 2005-07-05 |
| 6902950 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Xiao-Chun Mu, Quat Vu | 2005-06-07 |
| 6903452 | Packaging microelectromechanical structures | Valluri Rao, Li-Peng Wang, John Heck, Quan Tran | 2005-06-07 |
| 6890829 | Fabrication of on-package and on-chip structure using build-up layer process | Peng Cheng | 2005-05-10 |
| 6880235 | Method of forming a beam for a MEMS switch | — | 2005-04-19 |
| 6876053 | Isolation structure configurations for modifying stresses in semiconductor devices | Jin Lee, Harry Fujimoto, Changhong Dai, Shiuh-Wuu Lee, Travis Eiles +1 more | 2005-04-05 |
| 6861783 | Structure to achieve high-Q and low insertion loss film bulk acoustic resonators | Li-Peng Wang, Valluri Rao | 2005-03-01 |
| 6861599 | Integrated microsprings for speed switches | — | 2005-03-01 |
| 6852926 | Packaging microelectromechanical structures | Valluri Rao, John Heck, Daniel ManHung Wong, Michele Berry | 2005-02-08 |
| 6850133 | Electrode configuration in a MEMS switch | — | 2005-02-01 |