Issued Patents All Time
Showing 126–150 of 154 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6655924 | Peristaltic bubble pump | — | 2003-12-02 |
| 6650204 | Resonator frequency correction by modifying support structures | Peng Cheng, Valluri Rao | 2003-11-18 |
| 6630871 | Center-mass-reduced microbridge structures for ultra-high frequency MEM resonator | Peng Cheng | 2003-10-07 |
| 6621137 | MEMS device integrated chip package, and method of making same | Peng Cheng, Valluri Rao | 2003-09-16 |
| 6621022 | Reliable opposing contact structure | Kramadhati V. Ravi, Valluri Rao | 2003-09-16 |
| 6617682 | Structure for reducing die corner and edge stresses in microelectronic packages | Jim Maveety, Quan Tran | 2003-09-09 |
| 6600389 | Tapered structures for generating a set of resonators with systematic resonant frequencies | Peng Cheng | 2003-07-29 |
| 6593672 | MEMS-switched stepped variable capacitor and method of making same | Peng Cheng, Valluri Rao | 2003-07-15 |
| 6586836 | Process for forming microelectronic packages and intermediate structures formed therewith | Xiao-Chun Mu, Quat Vu, Steve Towle | 2003-07-01 |
| 6586822 | Integrated core microelectronic package | Quat Vu, Jian Li, Maria V. Henao, Xiao-Chun Mu | 2003-07-01 |
| 6573822 | Tunable inductor using microelectromechanical switches | Peng Cheng, Valluri Rao | 2003-06-03 |
| 6570245 | Stress shield for microelectronic dice | — | 2003-05-27 |
| 6570468 | Resonator frequency correction by modifying support structures | Peng Cheng, Valluri Rao | 2003-05-27 |
| 6562653 | Silicon interposer and multi-chip-module (MCM) with through substrate vias | Harry Fujimoto | 2003-05-13 |
| 6537706 | Method for making a photolithographic mask | Jin Lee, Jun Zheng, Giang T. Dao | 2003-03-25 |
| 6531668 | High-speed MEMS switch with high-resonance-frequency beam | — | 2003-03-11 |
| 6529093 | Microelectromechanical (MEMS) switch using stepped actuation electrodes | — | 2003-03-04 |
| 6509622 | Integrated circuit guard ring structures | Jin Lee, Quan Tran, Harry Fujimoto | 2003-01-21 |
| 6479921 | Micro-electromechanical structure resonator, method of making, and method of using | Peng Cheng | 2002-11-12 |
| 6445106 | Micro-electromechanical structure resonator, method of making, and method of using | Peng Cheng | 2002-09-03 |
| 6423570 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Xiao-Chun Mu, Quat Vu | 2002-07-23 |
| 6362091 | Method for making a semiconductor device having a low-k dielectric layer | Ebrahim Andideh, Quan Tran, Steve Towle | 2002-03-26 |
| 6355534 | Variable tunable range MEMS capacitor | Peng Cheng | 2002-03-12 |
| 6271469 | Direct build-up layer on an encapsulated die package | Chun Mu, Harry Fujimoto | 2001-08-07 |
| 6238954 | COF packaged semiconductor | Jin Lee, Chun Mu, Quat Vu, Jian Li, Larry E. Mosley | 2001-05-29 |