Issued Patents All Time
Showing 151–154 of 154 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6229216 | Silicon interposer and multi-chip-module (MCM) with through substrate vias | Harry Fujimoto | 2001-05-08 |
| 6219243 | Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units | Lise Varner, Harry Fujimoto | 2001-04-17 |
| 6154366 | Structures and processes for fabricating moisture resistant chip-on-flex packages | Chun Mu, Harry Fujimoto, John R. CARRUTHERS, Jian Li, Chuanbin Pan | 2000-11-28 |
| 5994660 | High power x-ray welding of metal-matrix composites | Richard A. Rosenberg, George A. Goeppner, John R. Noonan, William J. Farrell | 1999-11-30 |