Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Glass clad microelectronic substrate

Glass clad microelectronic substrate

US Patent 9445496 · Granted Sep 13, 2016

Estimated economic value: $11,798,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microelectronic assemblies with communication networks2025
Packaging architecture with intermediate routing layers2025
Cooling of conformal power delivery structures2025
Contactless communication using a waveguide extending through a substrate core2025
Fine-grained disaggregated server architecture2025
Device, method and system to mitigate stress on hybrid bonds in a multi-tier arr2025
Selective interconnects in back-end-of-line metallization stacks of integrated c2025
Contiguous shield structures in microelectronic assemblies having hybrid bonding2025
Microelectronic assemblies having backside die-to-package interconnects2025
Microelectronic assemblies2025
Direct bonding in microelectronic assemblies2025
Composite interposer structure and method of providing same2025