Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11270943 | Copper interconnect cladding | Flavio Griggio, Anthony V. Mule, Gopinath Trichy, Gokul Malyavanatham | 2022-03-08 |
| 10446439 | Low resistance interconnect | Gokul Malyavanatham | 2019-10-15 |
| 8508018 | Barrier layers | Rohan Akolkar, Sridhar Balakrishnan, James S. Clarke, Christopher J. Jezewski | 2013-08-13 |