Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11652067 | Methods of forming substrate interconnect structures for enhanced thin seed conduction | Christopher J. Jezewski, Flavio Griggio, Inane Meric, Jiun-Chan Yang | 2023-05-16 | $11,130,000 |
| 7279084 | Apparatus having plating solution container with current applying anodes | Harsono S. Simka, Sadasivan Shankar, Daniel J. Zierath, Iouri Lantassov, Terry Buckley +1 more | 2007-10-09 | $11,205,000 |