Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394722 | Dielectric capacitance recovery of inter-layer dielectric layers for advanced integrated circuit structure fabrication | Atul MADHAVAN, Abhishek Jain, Jinhong SHIN | 2025-08-19 |
| 11721554 | Stress compensation for wafer to wafer bonding | Chytra Pawashe, Aaron D. Lilak, Myra McDonnell, Brennen Mueller, Mauro J. Kobrinsky | 2023-08-08 |
| 10079266 | Modulation of magnetic properties through implantation and associated structures | Christopher J. Wiegand, MD Tofizur Rahman, Oleg Golonzka, Mengcheng Lu | 2018-09-18 |