Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer to wafer bonding with low wafer distortion

Wafer to wafer bonding with low wafer distortion

US Patent 10720345 · Granted Jul 21, 2020

Estimated economic value: $33,796,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Double-sided integrated circuit transistor structures with depopulated bottom ch2025
Vertically spaced intra-level interconnect line metallization for integrated cir2025
Epitaxial source/drain back-side device contact structures with wrap around meta2025
Integrated circuit structures with backside self-aligned penetrating conductive 2025
Gate-all-around integrated circuit structures having backside contact with enhan2025
Transistor with front-side and back-side contacts and routing2025
Backside electrical contact for PMOS epitaxial voltage supply2025
Low germanium, high boron silicon rich capping layer for PMOS contact resistance2025
Integrated circuit structures having backside gate tie-down2025
Hybrid manufacturing with modified via-last process2025
Integrated circuit interconnect structures with graphene cap2025
Digitally controlled lithographically-defined multi-frequency acoustic resonator2025