Issued Patents All Time
Showing 51–59 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6867473 | Plating a conductive material on a dielectric material | Michael Goodner, Steven W. Johnston | 2005-03-15 |
| 6867125 | Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material | Jihperng Leu, Hyun-Mog Park | 2005-03-15 |
| 6861332 | Air gap interconnect method | Hyun-Mog Park | 2005-03-01 |
| 6846755 | Bonding a metal component to a low-k dielectric material | Jihperng Leu | 2005-01-25 |
| 6737365 | Forming a porous dielectric layer | Kevin P. O'Brien, Justin K. Brask, Michael Goodner, Donald Bruner | 2004-05-18 |
| 6734094 | Method of forming an air gap within a structure by exposing an ultraviolet sensitive material to ultraviolet radiation | Jihperng Leu, Hyun-Mog Park | 2004-05-11 |
| 6734118 | Dielectric material treatment | David Staines, Jihperng Leu | 2004-05-11 |
| 6682989 | Plating a conductive material on a dielectric material | Michael Goodner, Steven W. Johnston | 2004-01-27 |
| 6605549 | Method for improving nucleation and adhesion of CVD and ALD films deposited onto low-dielectric-constant dielectrics | Jihperng Leu, Chih-I Wu, Ying Zhou | 2003-08-12 |