Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7238604 | Forming thin hard mask over air gap or porous dielectric | Kevin P. O'Brien, David H. Gracias, Hyun-Mog Park, Vijayakumar Ramachandrarao | 2007-07-03 |
| 7220668 | Method of patterning a porous dielectric material | Hyun-Mog Park, Boyan Boyanov, Vijayakumar Ramachandrarao | 2007-05-22 |
| 7217595 | Sealed three dimensional metal bonded integrated circuits | Patrick Morrow | 2007-05-15 |
| 7214605 | Deposition of diffusion barrier | Shriram Ramanathan, Patrick Morrow, Vijayakumar Ramachandrarao, Scott List | 2007-05-08 |
| 7214594 | Method of making semiconductor device using a novel interconnect cladding layer | Lawrence Wong, Jihperng Leu, Andrew Ott, Patrick Morrow | 2007-05-08 |
| 7186637 | Method of bonding semiconductor devices | Shriram Ramanathan, Chin-Chang Chen, Paul B. Fischer | 2007-03-06 |
| 7179755 | Forming a porous dielectric layer and structures formed thereby | Boyan Boyanov, Vijay Ramachandrarao, Hyun-Mog Park | 2007-02-20 |
| 7180180 | Stacked device underfill and a method of fabrication | Michael Goodner, Shriram Ramanathan, Patrick Morrow | 2007-02-20 |
| 7169715 | Forming a dielectric layer using porogens | Andrew Ott, Robert Meagley, Michael Goodner | 2007-01-30 |
| 7164206 | Structure in a microelectronic device including a bi-layer for a diffusion barrier and an etch-stop layer | Jihperng Leu, Lawrence Wong, Andrew Ott, Patrick Marrow | 2007-01-16 |
| 7145245 | Low-k dielectric film with good mechanical strength that varies in local porosity depending on location on substrate—therein | Lee Rockford, Jihperng Leu | 2006-12-05 |
| 7138158 | Forming a dielectric layer using a hydrocarbon-containing precursor | Robert Meagley, Michael Goodner, Andrew Ott, Michael L. McSwiney, Bob Leet | 2006-11-21 |
| 7122481 | Sealing porous dielectrics with silane coupling reagents | Chih-I Wu, Xiaorong Morrow | 2006-10-17 |
| 7087538 | Method to fill the gap between coupled wafers | David Staines, Shriram Ramanathan | 2006-08-08 |
| 7034399 | Forming a porous dielectric layer | Kevin P. O'Brien, Justin K. Brask, Michael Goodner, Donald Bruner | 2006-04-25 |
| 7030040 | Selectively growing a polymeric material on a semiconductor substrate | Michael Goodner | 2006-04-18 |
| 7018918 | Method of forming a selectively converted inter-layer dielectric using a porogen material | Kevin P. O'Brien, Michael Goodner, Jihperng Leu, David H. Gracias, Lee Rockford +2 more | 2006-03-28 |
| 6992391 | Dual-damascene interconnects without an etch stop layer by alternating ILDs | Andrew Ott, Lawrence Wong, Patrick Morrow, Jihperng Leu | 2006-01-31 |
| 6984873 | Method of forming a stacked device filler | David Staintes, Shriram Ramanathan | 2006-01-10 |
| 6964919 | Low-k dielectric film with good mechanical strength | Lee Rockford, Jihperng Leu | 2005-11-15 |
| 6946384 | Stacked device underfill and a method of fabrication | Michael Goodner, Shriram Ramanathan, Patrick Morrow | 2005-09-20 |
| 6943121 | Selectively converted inter-layer dielectric | Jihperng Leu, David H. Gracias, Lee Rockford, Peter K. Moon, Chris Barns | 2005-09-13 |
| 6930391 | Method for alloy-electroplating group IB metals with refractory metals for interconnections | Sean J. Hearne | 2005-08-16 |
| 6905958 | Protecting metal conductors with sacrificial organic monolayers | David H. Gracias | 2005-06-14 |
| 6903461 | Semiconductor device having a region of a material which is vaporized upon exposing to ultraviolet radiation | Jihperng Leu, Hyun-Mog Park | 2005-06-07 |