Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects

Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circuit interconnects

US Patent 7727892 · Granted Jun 1, 2010

Estimated economic value: $13,475,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems and methods for synchronization of independently encoded media streams2025
Surgeon specific bone plates2022
Resistive memory cells and precursors thereof, methods of making the same, and d2021
Resistive memory cells and precursors thereof, methods of making the same, and d2019
Surgical retaining instruments for bone plates2019
Compact unit2019
Two-dimensional condensation for uniaxially strained semiconductor fins2019
Two-dimensional condensation for uniaxially strained semiconductor fins2017
High dose radiation detector2017
Non-planar device having uniaxially strained semiconductor body and method of ma2017
Two-dimensional condensation for uniaxially strained semiconductor fins2016
Two-dimensional condensation for uniaxially strained semiconductor fins2015