Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7087996 | Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead | Donald Danielson, Dawn L. Scovell, Keith Willis | 2006-08-08 |
| 6749760 | Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead | Donald Danielson, Dawn L. Scovell, Keith Willis | 2004-06-15 |
| 6740427 | Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same | Madhav Datta, Dave Emory, Subhash M. Joshi, Christine A. King, Zhiyong Ma +4 more | 2004-05-25 |