Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7855103 | Wirebond structure and method to connect to a microelectronic die | Robert J. Gleixner, Patrick M. Paluda, Rajan Naik | 2010-12-21 |
| 7393772 | Wirebond structure and method to connect to a microelectronic die | Robert J. Gleixner, Patrick M. Paluda, Rajan Naik | 2008-07-01 |
| 7087996 | Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead | Tzeun-luh Huang, Dawn L. Scovell, Keith Willis | 2006-08-08 |
| 6924554 | Wirebond structure and method to connect to a microelectronic die | Robert J. Gleixner, Patrick M. Paluda, Rajan Naik | 2005-08-02 |
| 6749760 | Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead | Tzeun-luh Huang, Dawn L. Scovell, Keith Willis | 2004-06-15 |
| 6683383 | Wirebond structure and method to connect to a microelectronic die | Robert J. Gleixner, Patrick M. Paluda, Rajan Naik | 2004-01-27 |
| 6426176 | Method of forming a protective conductive structure on an integrated circuit package interconnection | Stanford W. Miller | 2002-07-30 |
| 6417098 | Enhanced surface modification of low K carbon-doped oxide | Lawrence Wong, Sarah Bowen, Ebrahim Andideh | 2002-07-09 |
| 5407526 | Chemical mechanical polishing slurry delivery and mixing system | Allen D. Feller, Kenneth Cadien | 1995-04-18 |
| 4975163 | Electrochemical refractory metal stripper and parts cleaning process | — | 1990-12-04 |