| 7855103 |
Wirebond structure and method to connect to a microelectronic die |
Robert J. Gleixner, Patrick M. Paluda, Rajan Naik |
2010-12-21 |
| 7393772 |
Wirebond structure and method to connect to a microelectronic die |
Robert J. Gleixner, Patrick M. Paluda, Rajan Naik |
2008-07-01 |
| 7087996 |
Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead |
Tzeun-luh Huang, Dawn L. Scovell, Keith Willis |
2006-08-08 |
| 6924554 |
Wirebond structure and method to connect to a microelectronic die |
Robert J. Gleixner, Patrick M. Paluda, Rajan Naik |
2005-08-02 |
| 6749760 |
Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead |
Tzeun-luh Huang, Dawn L. Scovell, Keith Willis |
2004-06-15 |
| 6683383 |
Wirebond structure and method to connect to a microelectronic die |
Robert J. Gleixner, Patrick M. Paluda, Rajan Naik |
2004-01-27 |
| 6426176 |
Method of forming a protective conductive structure on an integrated circuit package interconnection |
Stanford W. Miller |
2002-07-30 |
| 6417098 |
Enhanced surface modification of low K carbon-doped oxide |
Lawrence Wong, Sarah Bowen, Ebrahim Andideh |
2002-07-09 |
| 5407526 |
Chemical mechanical polishing slurry delivery and mixing system |
Allen D. Feller, Kenneth Cadien |
1995-04-18 |
| 4975163 |
Electrochemical refractory metal stripper and parts cleaning process |
— |
1990-12-04 |