Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7855103 | Wirebond structure and method to connect to a microelectronic die | Robert J. Gleixner, Donald Danielson, Rajan Naik | 2010-12-21 | $32,423,000 |
| 7393772 | Wirebond structure and method to connect to a microelectronic die | Robert J. Gleixner, Donald Danielson, Rajan Naik | 2008-07-01 | $20,189,000 |
| 6924554 | Wirebond structure and method to connect to a microelectronic die | Robert J. Gleixner, Donald Danielson, Rajan Naik | 2005-08-02 | $20,766,000 |
| 6683383 | Wirebond structure and method to connect to a microelectronic die | Robert J. Gleixner, Donald Danielson, Rajan Naik | 2004-01-27 | $81,098,000 |