Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7855103 | Wirebond structure and method to connect to a microelectronic die | Robert J. Gleixner, Donald Danielson, Rajan Naik | 2010-12-21 |
| 7393772 | Wirebond structure and method to connect to a microelectronic die | Robert J. Gleixner, Donald Danielson, Rajan Naik | 2008-07-01 |
| 6924554 | Wirebond structure and method to connect to a microelectronic die | Robert J. Gleixner, Donald Danielson, Rajan Naik | 2005-08-02 |
| 6683383 | Wirebond structure and method to connect to a microelectronic die | Robert J. Gleixner, Donald Danielson, Rajan Naik | 2004-01-27 |