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Home › Intel › Doowon Suh
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Doowon Suh — 7 Patents

Intel: 6 patents #6,200 of 30,777Top 25%
CRCree: 1 patents #444 of 639Top 70%
Cary, NC: #868 of 3,681 inventorsTop 25%
North Carolina: #7,540 of 45,564 inventorsTop 20%
Overall (All Time): #680,018 of 4,157,543Top 20%
7 Patents All Time
Doowon Suh has been granted 7 US patents while listed as an inventor at Intel. The first was granted in 2004 and the most recent in July 2018. Doowon Suh ranks #680,018 of 4,157,543 US inventors in our database (top 16.4%). Patent records list Doowon Suh in Cary, NC, US.

Patents per Year

Patents granted per year, 2004 to 2018Bar chart with a peak of 2 patents in 2007.peak 22004: 1 patents20042005: 1 patents20052007: 2 patents20072015: 1 patents20152016: 1 patents20162018: 1 patents2018

Issued Patents All Time

Showing 1–7 of 7 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
10037956 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same Madhav Datta, Dave Emory, Subhash M. Joshi, Susanne Menezes 2018-07-31 $36,087,000
9437785 Light emitting diodes including integrated backside reflector and die attach Michael John Bergmann, Kevin Haberern, Bradley E. Williams, Winston T. Parker, Arthur Fong-Yuen Pun +1 more 2016-09-06 $2,099,000
8952550 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same Madhav Datta, Dave Emory, Subhash M. Joshi, Susanne Menezes 2015-02-10 $17,498,000
7250678 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same Madhav Datta, Dave Emory, Subhash M. Joshi, Susanne Menezes 2007-07-31 $23,850,000
7196001 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same Madhav Datta, Dave Emory, Subhash M. Joshi, Susanne Menezes 2007-03-27 $11,700,000
6853076 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same Madhav Datta, Dave Emory, Subhash M. Joshi, Susanne Menezes 2005-02-08 $36,565,000
6740427 Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same Madhav Datta, Dave Emory, Tzeun-luh Huang, Subhash M. Joshi, Christine A. King +4 more 2004-05-25 $32,256,000

Frequent Collaborators

Dave Emory6 shared
Subhash M. Joshi6 shared
Madhav Datta6 shared
Susanne Menezes5 shared
Thomas Marieb1 shared
Bradley E. Williams1 shared

Nearby-Ranked Inventors

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WOOSEUP YOUM7
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