Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

US Patent 7196001 · Granted Mar 27, 2007

Estimated economic value: $11,700,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Self-aligned contacts2025
Trench contact structures for advanced integrated circuit structure fabrication2025
Trench contact structures for advanced integrated circuit structure fabrication2024
Self-aligned contacts2024
Continuous gate and fin spacer for advanced integrated circuit structure fabrica2023
Trench contact structures for advanced integrated circuit structure fabrication2023
Self-aligned contacts2023
Continuous gate and fin spacer for advanced integrated circuit structure fabrica2022
Epitaxial source or drain structures for advanced integrated circuit structure f2022
Trench contact structures for advanced integrated circuit structure fabrication2021
Trench contact structures for advanced integrated circuit structure fabrication2021
Self-aligned contacts2021