Issued Patents All Time
Showing 26–50 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11522059 | Metallic sealants in transistor arrangements | Abhishek A. Sharma, Tahir Ghani, Jack T. Kavalieros, Gilbert Dewey, Van H. Le +1 more | 2022-12-06 |
| 11482622 | Adhesion structure for thin film transistor | Kevin Lin, Abhishek A. Sharma, Carl Naylor, Urusa Alaan, Ashish Agrawal | 2022-10-25 |
| 11462684 | Retention improvement by high-k encapsulation of RRAM devices | Albert Chen, Nathan Strutt, Oleg Golonzka, Pedro Quintero, Elijah V. Karpov | 2022-10-04 |
| 11444024 | Subtractively patterned interconnect structures for integrated circuits | Kevin Lin, Noriyuki Sato, Tristan A. Tronic, Michael Christenson, Jiun-Ruey Chen +10 more | 2022-09-13 |
| 11444205 | Contact stacks to reduce hydrogen in thin film transistor | Arnab Sen Gupta, Matthew V. Metz, Benjamin Chu-Kung, Abhishek A. Sharma, Van H. Le +7 more | 2022-09-13 |
| 11430814 | Metallization structures for stacked device connectivity and their methods of fabrication | Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more | 2022-08-30 |
| 11393722 | Isolation wall stressor structures to improve channel stress and their methods of fabrication | Aaron D. Lilak, Willy Rachmady, Rishabh Mehandru, Gilbert Dewey, Anh Phan | 2022-07-19 |
| 11380617 | Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches | Jasmeet S. Chawla | 2022-07-05 |
| 11328993 | Cobalt based interconnects and methods of fabrication thereof | Tejaswi K. Indukuri, Ramanan V. Chebiam, Colin T. Carver | 2022-05-10 |
| 11276644 | Integrated circuits and methods for forming thin film crystal layers | Carl Naylor, Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Mauro J. Kobrinsky +1 more | 2022-03-15 |
| 11205586 | Integrated circuits with line breaks and line bridges within a single interconnect level | Kevin Lin | 2021-12-21 |
| 11201114 | Methods of forming thin film resistor structures utilizing interconnect liner materials | Kevin Lin, Richard Vreeland, Tristan A. Tronic | 2021-12-14 |
| 11171239 | Transistor channel passivation with 2D crystalline material | Carl Naylor, Abhishek A. Sharma, Mauro J. Kobrinsky, Urusa Alaan, Justin R. Weber | 2021-11-09 |
| 11164809 | Integrated circuits and methods for forming integrated circuits | Carl Naylor, Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Mauro J. Kobrinsky +1 more | 2021-11-02 |
| 11094587 | Use of noble metals in the formation of conductive connectors | Srijit Mukherjee, Daniel Bergstrom, Tejaswi K. Indukuri, Flavio Griggio, Ramanan V. Chebiam +1 more | 2021-08-17 |
| 10937689 | Self-aligned hard masks with converted liners | Manish Chandhok, Satyarth Suri, Tristan A. Tronic, Richard E. Schenker | 2021-03-02 |
| 10876610 | Self-locking nut and screw assembly | Thomas James Fields, Sorin Gavriliuc, Tyler Quincey Curtis | 2020-12-29 |
| 10700007 | Cobalt based interconnects and methods of fabrication thereof | Tejaswi K. Indukuri, Ramanan V. Chebiam, Colin T. Carver | 2020-06-30 |
| 10629525 | Seam healing of metal interconnects | Ramanan V. Chebiam, Tejaswi K. Indukuri, James S. Clarke, John J. Plombon | 2020-04-21 |
| 10529660 | Pore-filled dielectric materials for semiconductor structure fabrication and their methods of fabrication | Jessica M. Torres, Jeffery D. Bielefeld, Mauro J. Kobrinsky, Gopinath Bhimarasetti | 2020-01-07 |
| 10392100 | Mechanical load limiting and electrical load sensing device and system | Thomas James Fields, Tyler Quincey Curtis, Sorin Gavriliuc | 2019-08-27 |
| 10201081 | Electronic fabric with incorporated chip and interconnect | Ravi Pillarisetty, Brian S. Doyle | 2019-02-05 |
| 10068845 | Seam healing of metal interconnects | Ramanan V. Chebiam, Tejaswi K. Indukuri, James S. Clarke, John J. Plombon | 2018-09-04 |
| 10008557 | Vertical meander inductor for small core voltage regulators | Kevin P. O'Brien | 2018-06-26 |
| 9997457 | Cobalt based interconnects and methods of fabrication thereof | Tejaswi K. Indukuri, Ramanan V. Chebiam, Colin T. Carver | 2018-06-12 |