Issued Patents All Time
Showing 51–75 of 196 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791277 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan | 2023-10-17 |
| 11769751 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan | 2023-09-26 |
| 11756943 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan | 2023-09-12 |
| 11749649 | Composite IC chips including a chiplet embedded within metallization layers of a host IC chip | Adel A. Elsherbini, Johanna M. Swan, Patrick Morrow, Gerald Pasdast, Van H. Le | 2023-09-05 |
| 11749642 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Johanna M. Swan | 2023-09-05 |
| 11735551 | Aligned core balls for interconnect joint stability | Jimin Yao, Xin Yan, Numair Ahmed | 2023-08-22 |
| 11735533 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Srinivas V. Pietambaram, Bharat P. Penmecha | 2023-08-22 |
| 11721649 | Microelectronic assemblies | Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Kimin Jun, Brennen Mueller +2 more | 2023-08-08 |
| 11694986 | Vias in composite IC chip structures | Adel A. Elsherbini, Patrick Morrow, Johanna M. Swan, Mauro Kobrinksy, Van H. Le +1 more | 2023-07-04 |
| 11676900 | Electronic assembly that includes a bridge | Eric J. Li, Nitin A. Deshpande, Omkar G. Karhade, Amram Eitan, Timothy A. Gosselin | 2023-06-13 |
| 11664303 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Brandon M. Rawlings, Veronica Strong | 2023-05-30 |
| 11616047 | Microelectronic assemblies | Adel A. Elsherbini, Feras Eid, Johanna M. Swan | 2023-03-28 |
| 11605603 | Microelectronic package with radio frequency (RF) chiplet | Adel A. Elsherbini, Georgios Dogiamis, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan +1 more | 2023-03-14 |
| 11600594 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan, Arun Chandrasekhar | 2023-03-07 |
| 11581282 | Serializer-deserializer die for high speed signal interconnect | Adel A. Elsherbini, Johanna M. Swan, Gerald Pasdast | 2023-02-14 |
| 11581238 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Adel A. Elsherbini, Johanna M. Swan, Jimin Yao, Veronica Strong | 2023-02-14 |
| 11569428 | Superconducting qubit device packages | Jeanette M. Roberts, Adel A. Elsherbini, Johanna M. Swan, Roman Caudillo, Zachary R. Yoscovits +4 more | 2023-01-31 |
| 11552035 | Electronic package with stud bump electrical connections | Zhaozhi Li, Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu +1 more | 2023-01-10 |
| 11525970 | Microelectronic package communication using radio interfaces connected through wiring | Adel A. Elsherbini, Telesphor Kamgaing, Sasha N. Oster, Gaurav Chawla | 2022-12-13 |
| 11527501 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Brandon M. Rawlings, Jagat Shakya, Johanna M. Swan +3 more | 2022-12-13 |
| 11508587 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan | 2022-11-22 |
| 11508898 | Piezoelectric devices fabricated in packaging build-up layers | Feras Eid | 2022-11-22 |
| 11494682 | Quantum computing assemblies | Adel A. Elsherbini, Jeanette M. Roberts, James S. Clarke | 2022-11-08 |
| 11469209 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan | 2022-10-11 |
| 11460499 | Dual sided thermal management solutions for integrated circuit packages | Henning Braunisch, Aleksandar Aleksov, Veronica Strong, Brandon M. Rawlings, Johanna M. Swan | 2022-10-04 |