| 11901330 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan, Arun Chandrasekhar |
2024-02-13 |
$18,546,000 |
| 11881457 |
Semiconductor packaging with high density interconnects |
Adel A. Elsherbini, Johanna M. Swan, Henning Braunisch, Krishna Bharath, Javier Soto Gonzalez +1 more |
2024-01-23 |
|
| 11870163 |
Antenna package using ball attach array to connect antenna and base substrates |
Jimin Yao, Robert L. Sankman, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang |
2024-01-09 |
$30,329,000 |
| 11830831 |
Semiconductor package including a modular side radiating waveguide launcher |
Georgios Dogiamis, Sasha N. Oster, Johanna M. Swan, Adel A. Elsherbini, Telesphor Kamgaing +1 more |
2023-11-28 |
$31,872,000 |
| 11824018 |
Heterogeneous nested interposer package for IC chips |
Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Srinivas V. Pietambaram, Bharat P. Penmecha |
2023-11-21 |
|
| 11791277 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan |
2023-10-17 |
$15,641,000 |
| 11769751 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan |
2023-09-26 |
$20,953,000 |
| 11756943 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan |
2023-09-12 |
$19,004,000 |
| 11749649 |
Composite IC chips including a chiplet embedded within metallization layers of a host IC chip |
Adel A. Elsherbini, Johanna M. Swan, Patrick Morrow, Gerald Pasdast, Van H. Le |
2023-09-05 |
$19,899,000 |
| 11749642 |
Microelectronic assemblies with communication networks |
Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Johanna M. Swan |
2023-09-05 |
$19,899,000 |
| 11735551 |
Aligned core balls for interconnect joint stability |
Jimin Yao, Xin Yan, Numair Ahmed |
2023-08-22 |
$16,803,000 |
| 11735533 |
Heterogeneous nested interposer package for IC chips |
Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Srinivas V. Pietambaram, Bharat P. Penmecha |
2023-08-22 |
$16,803,000 |
| 11721649 |
Microelectronic assemblies |
Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Kimin Jun, Brennen Mueller +2 more |
2023-08-08 |
$22,376,000 |
| 11694986 |
Vias in composite IC chip structures |
Adel A. Elsherbini, Patrick Morrow, Johanna M. Swan, Mauro Kobrinksy, Van H. Le +1 more |
2023-07-04 |
|
| 11676900 |
Electronic assembly that includes a bridge |
Eric J. Li, Nitin A. Deshpande, Omkar G. Karhade, Amram Eitan, Timothy A. Gosselin |
2023-06-13 |
$22,204,000 |
| 11664303 |
Interconnection structure fabrication using grayscale lithography |
Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Brandon M. Rawlings, Veronica Strong |
2023-05-30 |
$16,378,000 |
| 11616047 |
Microelectronic assemblies |
Adel A. Elsherbini, Feras Eid, Johanna M. Swan |
2023-03-28 |
$20,940,000 |
| 11605603 |
Microelectronic package with radio frequency (RF) chiplet |
Adel A. Elsherbini, Georgios Dogiamis, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan +1 more |
2023-03-14 |
$29,588,000 |
| 11600594 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan, Arun Chandrasekhar |
2023-03-07 |
$16,825,000 |
| 11581282 |
Serializer-deserializer die for high speed signal interconnect |
Adel A. Elsherbini, Johanna M. Swan, Gerald Pasdast |
2023-02-14 |
$12,790,000 |
| 11581238 |
Heat spreading layer integrated within a composite IC die structure and methods of forming the same |
Adel A. Elsherbini, Johanna M. Swan, Jimin Yao, Veronica Strong |
2023-02-14 |
$12,790,000 |
| 11569428 |
Superconducting qubit device packages |
Jeanette M. Roberts, Adel A. Elsherbini, Johanna M. Swan, Roman Caudillo, Zachary R. Yoscovits +4 more |
2023-01-31 |
|
| 11552035 |
Electronic package with stud bump electrical connections |
Zhaozhi Li, Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu +1 more |
2023-01-10 |
$14,061,000 |
| 11525970 |
Microelectronic package communication using radio interfaces connected through wiring |
Adel A. Elsherbini, Telesphor Kamgaing, Sasha N. Oster, Gaurav Chawla |
2022-12-13 |
$11,573,000 |
| 11527501 |
Sacrificial redistribution layer in microelectronic assemblies having direct bonding |
Adel A. Elsherbini, Veronica Strong, Brandon M. Rawlings, Jagat Shakya, Johanna M. Swan +3 more |
2022-12-13 |
$11,573,000 |
