Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic package with radio frequency (RF) chiplet

Microelectronic package with radio frequency (RF) chiplet

US Patent 11605603 · Granted Mar 14, 2023

Estimated economic value: $29,588,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Microelectronic assemblies with communication networks2025
Microelectronic assemblies with communication networks2025
Microelectronic assemblies with communication networks2025
Packaging architecture with intermediate routing layers2025
Packaging architecture with intermediate routing layers2025
Packaging architecture with intermediate routing layers2025
Packaging architecture with intermediate routing layers2025
Substrate integrated thin film capacitors using amorphous high-k dielectrics2025
Substrate integrated thin film capacitors using amorphous high-k dielectrics2025
Apparatus and method of manufacturing a vertically disaggregated photonic device2025