{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Serializer-deserializer die for high speed signal interconnect", "item": "https://www.patentleaderboard.com/patent/11581282"}]}
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Home › Serializer-deserializer die for high speed signal interconnect

Serializer-deserializer die for high speed signal interconnect

US Patent 11581282 · Granted Feb 14, 2023

Estimated economic value: $12,790,000 ⓘ

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