Issued Patents All Time
Showing 76–100 of 196 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11460499 | Dual sided thermal management solutions for integrated circuit packages | Henning Braunisch, Aleksandar Aleksov, Veronica Strong, Brandon M. Rawlings, Johanna M. Swan | 2022-10-04 |
| 11450560 | Microelectronic assemblies having magnetic core inductors | Krishna Bharath, Adel A. Elsherbini, Kaladhar Radhakrishnan, Zhiguo Qian, Johanna M. Swan | 2022-09-20 |
| 11437348 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Johanna M. Swan | 2022-09-06 |
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more | 2022-08-30 |
| 11421376 | Inorganic piezoelectric materials formed on fibers and applications thereof | Feras Eid, Aleksandar Aleksov, Sasha N. Oster, Baris Bicen, Thomas L. Sounart +2 more | 2022-08-23 |
| 11417593 | Dies with integrated voltage regulators | Adel A. Elsherbini, Krishna Bharath, Johanna M. Swan | 2022-08-16 |
| 11394094 | Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements | Telesphor Kamgaing, Sasha N. Oster, Georgios Dogiamis, Adel A. Elsherbini, Aleksandar Aleksov +2 more | 2022-07-19 |
| 11393777 | Microelectronic assemblies | Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Kimin Jun, Brennen Mueller +2 more | 2022-07-19 |
| 11387175 | Interposer package-on-package (PoP) with solder array thermal contacts | Debendra Mallik, Sanka Ganesan, Pilin Liu, Sri Chaitra Jyotsna Chavali, Sandeep Gaan +2 more | 2022-07-12 |
| 11380624 | Electromagnetic interference shield created on package using high throughput additive manufacturing | Feras Eid, Henning Braunisch, Georgios Dogiamis, Johanna M. Swan | 2022-07-05 |
| 11367689 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Johanna M. Swan | 2022-06-21 |
| 11367707 | Semiconductor package or structure with dual-sided interposers and memory | Adel A. Elsherbini, Johanna M. Swan, Gerald Pasdast | 2022-06-21 |
| 11355849 | Antenna package using ball attach array to connect antenna and base substrates | Jimin Yao, William J. Lambert, Zhichao Zhang, Robert L. Sankman, Sri Chaitra Jyotsna Chavali | 2022-06-07 |
| 11348897 | Microelectronic assemblies | Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Johanna M. Swan, Patrick Morrow +3 more | 2022-05-31 |
| 11348912 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan, Arun Chandrasekhar | 2022-05-31 |
| 11348895 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan, Arun Chandrasekhar | 2022-05-31 |
| 11342320 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan, Arun Chandrasekhar | 2022-05-24 |
| 11336559 | Fast-lane routing for multi-chip packages | Adel A. Elsherbini, Tejpal Singh, Gerald Pasdast, Johanna M. Swan | 2022-05-17 |
| 11335665 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan | 2022-05-17 |
| 11335663 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan, Arun Chandrasekhar | 2022-05-17 |
| 11335651 | Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric | Telesphor Kamgaing, Georgios Dogiamis, Vijay K. Nair, Javier A. Falcon, Yoshihiro Tomita | 2022-05-17 |
| 11335642 | Microelectronic assemblies | Adel A. Elsherbini, Johanna M. Swan | 2022-05-17 |
| 11322455 | Robust mold integrated substrate | Jimin Yao, Kyle Yazzie | 2022-05-03 |
| 11309619 | Waveguide coupling systems and methods | Sasha N. Oster, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini, Aleksandar Aleksov +1 more | 2022-04-19 |
| 11302618 | Microelectronic assemblies having substrate-integrated perovskite layers | Feras Eid, Thomas L. Sounart, Johanna M. Swan | 2022-04-12 |