Issued Patents All Time
Showing 126–150 of 196 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950919 | System comprising first and second servers interconnected by a plurality of joined waveguide sections | Telesphor Kamgaing, Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Brandon M. Rawlings +3 more | 2021-03-16 |
| 10943851 | Reconstituted wafer assembly | Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan | 2021-03-09 |
| 10923415 | Semiconductor package having integrated stiffener region | Eng Huat Goh, Jiun Hann Sir, Min Suet Lim, Feras Eid | 2021-02-16 |
| 10921349 | Piezoelectric package-integrated current sensing devices | Georgios Dogiamis, Adel A. Elsherbini, Johanna M. Swan, Jelena Culic-Viskota, Thomas L. Sounart +2 more | 2021-02-16 |
| 10868366 | Package architecture for antenna arrays | Adel A. Elsherbini, William J. Lambert | 2020-12-15 |
| 10852495 | Microelectronic package communication using radio interfaces connected through wiring | Adel A. Elsherbini, Telesphor Kamgaing, Sasha N. Oster, Gaurav Chawla | 2020-12-01 |
| 10845552 | Coreless package architecture for multi-chip opto-electronics | Henning Braunisch, Timothy A. Gosselin, Prasanna Raghavan, Yikang Deng, Zhiguo Qian | 2020-11-24 |
| 10840430 | Piezoelectric package-integrated sensing devices | Feras Eid, Sasha N. Oster, Georgios Dogiamis, Adel A. Elsherbini, Thomas L. Sounart +1 more | 2020-11-17 |
| 10816733 | Piezoelectrically actuated mirrors for optical communications | Sasha N. Oster, Johanna M. Swan, Feras Eid, Thomas L. Sounart, Aleksandar Aleksov +2 more | 2020-10-27 |
| 10820437 | Flexible packaging for a wearable electronic device | Aleksandar Aleksov, Son V. Nguyen, Rajat Goyal, David B. Lampner, Dilan Seneviratne +4 more | 2020-10-27 |
| 10790231 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Eric J. Li, Timothy A. Gosselin, Yoshihiro Tomita, Amram Eitan, Mark Saltas | 2020-09-29 |
| 10748844 | Stress isolation for silicon photonic applications | Siddarth Kumar | 2020-08-18 |
| 10734358 | Multi-packaging for single-socketing | Jonathan L. Rosch, Amruthavalli Pallavi Alur, Arun Chandrasekhar | 2020-08-04 |
| 10721568 | Piezoelectric package-integrated acoustic transducer devices | Georgios Dogiamis, Feras Eid, Adel A. Elsherbini, Johanna M. Swan, Thomas L. Sounart +1 more | 2020-07-21 |
| 10707171 | Ultra small molded module integrated with die by module-on-wafer assembly | Tomita YOSHIHIRO, Eric J. Li, Javier A. Falcon, Joshua D. Heppner | 2020-07-07 |
| 10658566 | Piezoelectric driven switches integrated in organic, flexible displays | Feras Eid, Aleksandar Aleksov, Sasha N. Oster, Baris Bicen, Thomas L. Sounart +3 more | 2020-05-19 |
| 10649158 | Alignment of single and multi-mode optical fibers using piezoelectric actuators | Johanna M. Swan, Aleksandar Aleksov, Sasha N. Oster, Feras Eid, Baris Bicen +2 more | 2020-05-12 |
| 10644616 | Piezoelectric package-integrated motor | Georgios Dogiamis, Sasha N. Oster, Feras Eid, Adel A. Elsherbini, Thomas L. Sounart +1 more | 2020-05-05 |
| 10634566 | Piezoelectric package-integrated temperature sensing devices | Feras Eid, Sasha N. Oster, Georgios Dogiamis, Thomas L. Sounart, Adel A. Elsherbini +1 more | 2020-04-28 |
| 10636716 | Through-mold structures | Sasha N. Oster, Srikant Nekkanty, Joshua D. Heppner, Adel A. Elsherbini, Yoshihiro Tomita +2 more | 2020-04-28 |
| 10629557 | Improving mechanical and thermal reliability in varying form factors | Veronica Strong, Sasha N. Oster | 2020-04-21 |
| 10594029 | Actuatable and adaptable metamaterials integrated in package | Adel A. Elsherbini, Sasha N. Oster, Feras Eid, Georgios Dogiamis, Thomas L. Sounart +1 more | 2020-03-17 |
| 10573608 | Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package | Georgios Dogiamis, Telesphor Kamgaing, Eric J. Li, Javier A. Falcon, Yoshihiro Tomita +1 more | 2020-02-25 |
| 10566672 | Waveguide connector with tapered slot launcher | Adel A. Elsherbini, Sasha N. Oster, Johanna M. Swan, Georgios Dogiamis, Aleksandar Aleksov +1 more | 2020-02-18 |
| 10504863 | Variable ball height on ball grid array packages by solder paste transfer | Eric J. Li, Jimin Yao | 2019-12-10 |