Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11276625 | Methods of forming flexure based cooling solutions for package structures | Shubhada H. Sahasrabudhe, Sandeep B. Sane, Shalabh Tandon | 2022-03-15 | $18,336,000 |
| 10748844 | Stress isolation for silicon photonic applications | Shawna M. Liff | 2020-08-18 | $29,577,000 |
| 9953934 | Warpage controlled package and method for same | Sandeep B. Sane, Shubhada H. Sahasrabudhe, Shalabh Tandon | 2018-04-24 | $19,097,000 |
| 9930793 | Electric circuit on flexible substrate | Chuan Hu | 2018-03-27 | $21,620,000 |
| 9735089 | Thermal management for flexible integrated circuit packages | Hemanth K. Dhavaleswarapu | 2017-08-15 | $8,272,000 |
| 9659908 | Systems and methods for package on package through mold interconnects | Shubhada H. Sahasrabudhe, Sandeep B. Sane, Shalabh Tandon | 2017-05-23 | $7,972,000 |
| 8454023 | Retractable seal system | Omprakash Samudrala, Gregory Allan Crum, Karimulla Shaik Sha | 2013-06-04 | $29,228,000 |