Issued Patents All Time
Showing 176–196 of 196 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9832863 | Method of fabricating a stretchable computing device | Adel A. Elsherbini, Aleksandar Aleksov | 2017-11-28 |
| 9824901 | Complex cavity formation in molded packaging structures | Sasha N. Oster, Adel A. Elsherbini, Joshua D. Heppner | 2017-11-21 |
| 9822470 | Flexible embedded interconnects | Sasikanth Manipatruni, Brian S. Doyle, Vivek Singh | 2017-11-21 |
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more | 2017-11-14 |
| 9721880 | Integrated circuit package structures | Jimin Yao, Sanka Ganesan, Yikang Deng, Debendra Mallik | 2017-08-01 |
| 9716067 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Feras Eid, Nitin A. Deshpande | 2017-07-25 |
| 9711284 | Structure to make supercapacitor | Brian S. Doyle, Sasikanth Manipatruni, Vivek Singh | 2017-07-18 |
| 9685388 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Kinya Ichikawa, Nitin A. Deshpande | 2017-06-20 |
| 9635764 | Integrated circuit and method that utilize a shape memory material | Shipeng Qiu, Kayleen L. E. Helms, Joshua D. Heppner, Adel A. Elsherbini, Johanna M. Swan +1 more | 2017-04-25 |
| 9530747 | Solder in cavity interconnection structures | Chuan Hu, Gregory S. Clemons | 2016-12-27 |
| 9520378 | Thermal matched composite die | Aleksandar Aleksov | 2016-12-13 |
| 9507086 | Optical I/O system using planar light-wave integrated circuit | Mauro J. Kobrinsky, Henning Braunisch, Peter L. D. Chang, Bruce A. Block, Johanna M. Swan | 2016-11-29 |
| 9502368 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Kinya Ichikawa, Nitin A. Deshpande | 2016-11-22 |
| 9461355 | Method apparatus and material for radio frequency passives and antennas | Vijay K. Nair, Chuan Hu, Larry E. Mosley | 2016-10-04 |
| 9435967 | Optical connection techniques and configurations | Henning Braunisch, Peter L. D. Chang | 2016-09-06 |
| 9391427 | Thermal management in packaged VCSELs | Feras Eid, Henning Braunisch | 2016-07-12 |
| 9377594 | Two-dimensional, high-density optical connector | Jia-Hung Tseng, Peter L. D. Chang | 2016-06-28 |
| 9310553 | Optical connection techniques and configurations | Henning Braunisch, Peter L. D. Chang | 2016-04-12 |
| 9275955 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Feras Eid, Nitin A. Deshpande | 2016-03-01 |
| 9006890 | Solder in cavity interconnection structures | Chuan Hu, Gregory S. Clemons | 2015-04-14 |
| 8936967 | Solder in cavity interconnection structures | Chuan Hu, Gregory S. Clemons | 2015-01-20 |