Issued Patents All Time
Showing 151–175 of 196 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468367 | Solder in cavity interconnection structures | Chuan Hu, Gregory S. Clemons | 2019-11-05 |
| 10446461 | Complex cavity formation in molded packaging structures | Sasha N. Oster, Adel A. Elsherbini, Joshua D. Heppner | 2019-10-15 |
| 10424559 | Thermal management of molded packages | Feras Eid, Nader N. Abazarnia, Johanna M. Swan, Taesha D. Beasley, Sasha N. Oster +1 more | 2019-09-24 |
| 10418329 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Eric J. Li, Timothy A. Gosselin, Yoshihiro Tomita, Amram Eitan, Mark Saltas | 2019-09-17 |
| 10380496 | Quantum computing assemblies | Adel A. Elsherbini, Javier A. Falcon, Hubert C. George, James S. Clarke | 2019-08-13 |
| 10368439 | Assembly architecture employing organic support for compact and improved assembly throughput | Adel A. Elsherbini, Aleksandar Aleksov, Sasha N. Oster | 2019-07-30 |
| 10319896 | Shielded interconnects | Javier A. Falcon, Adel A. Elsherbini, Johanna M. Swan, Ye Seul Nam, James S. Clarke +2 more | 2019-06-11 |
| 10305019 | Piezoelectric devices fabricated in packaging build-up layers | Feras Eid | 2019-05-28 |
| 10297567 | Thermocompression bonding using plasma gas | Donglai Lu, Jimin Yao, Amrita Mallik, George Kostiew | 2019-05-21 |
| 10263312 | Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards | Sasha N. Oster, Aleksandar Aleksov, Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini +3 more | 2019-04-16 |
| 10256521 | Waveguide connector with slot launcher | Adel A. Elsherbini, Sasha N. Oster, Johanna M. Swan, Georgios Dogiamis, Aleksandar Aleksov +1 more | 2019-04-09 |
| 10256205 | Variable ball height on ball grid array packages by solder paste transfer | Eric J. Li, Jimin Yao | 2019-04-09 |
| 10249515 | Electronic device package | Jimin Yao, Eric J. Li | 2019-04-02 |
| 10249925 | Dielectric waveguide bundle including a supporting feature for connecting first and second server boards | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Johanna M. Swan +3 more | 2019-04-02 |
| 10212827 | Apparatus for interconnecting circuitry | John J. Browne, Andrew Maclean | 2019-02-19 |
| 10122089 | Magnetic nanocomposite materials and passive components formed therewith | Vijay K. Nair, Chuan Hu, Larry E. Mosley | 2018-11-06 |
| 10116504 | Package integrated security features | Adel A. Elsherbini, Sasha N. Oster, Feras Eid, Georgios Dogiamis, Thomas L. Sounart +1 more | 2018-10-30 |
| 10090259 | Non-rectangular electronic device components | Pramod Malatkar, Sairam Agraharam | 2018-10-02 |
| 10081887 | Electrically functional fabric for flexible electronics | Sasikanth Manipatruni, Brian S. Doyle, Vivek Singh | 2018-09-25 |
| 10070520 | Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier | Yoshihiro Tomita, Joshua D. Heppner, Pramod Malatkar | 2018-09-04 |
| 10068852 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Feras Eid, Nitin A. Deshpande | 2018-09-04 |
| 10054737 | Optical I/O system using planar light-wave integrated circuit | Mauro J. Kobrinsky, Henning Braunisch, Peter L. D. Chang, Bruce A. Block, Johanna M. Swan | 2018-08-21 |
| 9942980 | Wavy interconnect for bendable and stretchable devices | Chuan Hu, Adel A. Elsherbini, Yoshihiro Tomita | 2018-04-10 |
| 9902152 | Piezoelectric package-integrated synthetic jet devices | Feras Eid, Sasha N. Oster, Thomas L. Sounart, Georgios Dogiamis, Adel A. Elsherbini +1 more | 2018-02-27 |
| 9842818 | Variable ball height on ball grid array packages by solder paste transfer | Eric J. Li, Jimin Yao | 2017-12-12 |