Issued Patents All Time
Showing 51–66 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10076808 | Lead-free solder alloy | Tsukasa Ohnishi, Shunsaku Yoshikawa, Ken Tachibana, Yoshie Yamanaka, Hikaru Nomura | 2018-09-18 |
| 10026691 | Package substrate having noncircular interconnects | Kristof Darmawikarta, Daniel N. Sobieski | 2018-07-17 |
| 9947631 | Surface finishes for interconnection pads in microelectronic structures | Srinivas V. Pietambaram | 2018-04-17 |
| 9917044 | Package with bi-layered dielectric structure | Zheng Zhou, Mihir K. Roy, Chong Zhang, Amanda E. Schuckman | 2018-03-13 |
| 9865568 | Integrated circuit structures with recessed conductive contacts for package on package | Islam A. Salama, Ram Viswanath, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali | 2018-01-09 |
| 9837341 | Tin-zinc microbump structures | Sri Chaitra Jyotsna Chavali, Amanda E. Schuckman | 2017-12-05 |
| 9791470 | Magnet placement for integrated sensor packages | Feras Eid, Sasha N. Oster, Sarah Haney | 2017-10-17 |
| 9607947 | Reliable microstrip routing for electronics components | Omkar G. Karhade, Nevin Altunyurt, Krishna Bharath | 2017-03-28 |
| 9505607 | Methods of forming sensor integrated packages and structures formed thereby | Zheng Zhou, Islam A. Salama, Feras Eid, Sasha N. Oster, Lay Wai Kong +1 more | 2016-11-29 |
| 9501068 | Integration of pressure sensors into integrated circuit fabrication and packaging | Sasha N. Oster, Feras Eid, Sarah Haney | 2016-11-22 |
| 9391025 | Reliable microstrip routing for electronics components | Omkar G. Karhade, Nevin Altunyurt, Krishna Bharath | 2016-07-12 |
| 9355952 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Mihir K. Roy, Tao Wu, Yueli Liu | 2016-05-31 |
| 9260294 | Integration of pressure or inertial sensors into integrated circuit fabrication and packaging | Sasha N. Oster, Feras Eid, Sarah Haney | 2016-02-16 |
| 9093313 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Mihir K. Roy, Tao Wu, Yueli Liu | 2015-07-28 |
| 9041205 | Reliable microstrip routing for electronics components | Omkar G. Karhade, Nevin Altunyurt, Krishna Bharath | 2015-05-26 |
| 8835217 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Mihir K. Roy, Tao Wu, Yueli Liu | 2014-09-16 |