Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266581 | Electronic substrates having heterogeneous dielectric layers | Joshua Stacey, Whitney Bryks, Peumie Abeyratne Kuragama, Junxin Wang | 2025-04-01 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more | 2024-07-09 |