Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158558 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2021-10-26 |
| 10971492 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Cheng Xu, Rahul Jain, Seo Young Kim, Kyu Oh Lee, Ji-Yong Park +1 more | 2021-04-06 |
| 10741947 | Plated through hole socketing coupled to a solder ball to engage with a pin | Amruthavalli Pallavi Alur, Siddharth K. Alur, Liwei Cheng, Lauren A. Link, Jonathan L. Rosch +1 more | 2020-08-11 |
| 10700021 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Rahul Jain, Prithwish Chatterjee, Lauren A. Link | 2020-06-30 |
| 10692965 | 3D conductive ink printing method and inductor formed thereof | Chong Zhang, Andrew J. Brown, Sheng Li, Ying Wang | 2020-06-23 |
| 10672859 | Embedded magnetic inductor | Andrew J. Brown, Rahul Jain, Sheng Li, Chong Zhang | 2020-06-02 |
| 10643994 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Cheng Xu, Rahul Jain, Seo Young Kim, Kyu Oh Lee, Ji-Yong Park +1 more | 2020-05-05 |
| 10373951 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Cheng Xu, Rahul Jain, Seo Young Kim, Kyu Oh Lee, Ji-Yong Park +1 more | 2019-08-06 |