Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11246218 | Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate | Chong Zhang, Ying Wang, Cheng Xu, Yikang Deng | 2022-02-08 |
| 11217534 | Galvanic corrosion protection for semiconductor packages | Cheng Xu, Ji-Yong Park, Kyu Oh Lee | 2022-01-04 |
| 11031360 | Techniques for an inductor at a second level interface | Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji-Yong Park, Srinivas V. Pietambaram +3 more | 2021-06-08 |
| 10971492 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Cheng Xu, Rahul Jain, Seo Young Kim, Kyu Oh Lee, Ji-Yong Park +1 more | 2021-04-06 |
| 10804188 | Electronic device including a lateral trace | Yikang Deng, Ying Wang, Cheng Xu, Chong Zhang | 2020-10-13 |
| 10790159 | Semiconductor package substrate with through-hole magnetic core inductor using conductive paste | Cheng Xu, Chong Zhang, Yikang Deng, Ying Wang | 2020-09-29 |
| 10777514 | Techniques for an inductor at a second level interface | Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji-Yong Park, Srinivas V. Pietambaram +3 more | 2020-09-15 |
| 10643994 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Cheng Xu, Rahul Jain, Seo Young Kim, Kyu Oh Lee, Ji-Yong Park +1 more | 2020-05-05 |
| 10373951 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Cheng Xu, Rahul Jain, Seo Young Kim, Kyu Oh Lee, Ji-Yong Park +1 more | 2019-08-06 |