Issued Patents All Time
Showing 51–68 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692847 | Inorganic interposer for multi-chip packaging | Daniel N. Sobieski, Kristof Darmawikarta, Merve Celikkol, Kyu Oh Lee, Kemal Aygun +1 more | 2020-06-23 |
| 10494700 | Method of fabricating a microelectronic substrate | Robert Alan May, Amruthavalli Pallavi Alur, Daniel N. Sobieski | 2019-12-03 |
| 10453812 | Polarization defined zero misalignment vias for semiconductor packaging | Hiroki Tanaka, Aleksandar Aleksov, Robert Alan May, Kristof Darmawikarta | 2019-10-22 |
| 10431537 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2019-10-01 |
| 10403564 | Dual-damascene zero-misalignment-via process for semiconductor packaging | Aleksandar Aleksov, Hiroki Tanaka, Robert Alan May, Kristof Darmawikarta, Changhua Liu +2 more | 2019-09-03 |
| 10361121 | Aluminum oxide for thermal management or adhesion | Kristof Darmawikarta | 2019-07-23 |
| 10163798 | Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Robert Alan May, Islam A. Salama, Robert L. Sankman | 2018-12-25 |
| 10121679 | Package substrate first-level-interconnect architecture | Aleksandar Aleksov, Kristof Darmawikarta, Arnab Sarkar, Hiroki Tanaka, Robert Alan May | 2018-11-06 |
| 10043740 | Package with passivated interconnects | Rahul N. Manepalli, Dilan Seneviratne, Srinivas V. Pietambaram, Kristof Darmawikarta, Robert Alan May +1 more | 2018-08-07 |
| 9941054 | Integration of embedded thin film capacitors in package substrates | Robert L. Sankman, Daniel N. Sobieski | 2018-04-10 |
| 9820386 | Plasma etching of solder resist openings | Kristof Darmawikarta, Rahul Jain, Robert Alan May, Sheng Li | 2017-11-14 |
| 9758845 | Microelectronic substrates having copper alloy conductive route structures | Robert Alan May, Amruthavalli Pallavi Alur, Daniel N. Sobieski | 2017-09-12 |
| 9741606 | Desmear with metalized protective film | Zheng Zhou, Amanda E. Schuckman | 2017-08-22 |
| 9735120 | Low z-height package assembly | Qinglei Zhang | 2017-08-15 |
| 9449923 | Methods of forming substrate microvias with anchor structures | Qinglei Zhang | 2016-09-20 |
| 9420693 | Integration of embedded thin film capacitors in package substrates | Robert L. Sankman, Daniel N. Sobieski | 2016-08-16 |
| 9245795 | Methods of forming substrate microvias with anchor structures | Qinglei Zhang | 2016-01-26 |
| 9202803 | Laser cavity formation for embedded dies or components in substrate build-up layers | Chong Zhang, Stefanie M. Lotz, Qinglei Zhang, Nikhil Sharma, Islam A. Salama | 2015-12-01 |