Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080660 | Package with different types of semiconductor dies attached to a flange | Xikun Zhang, Dejiang Chang, Bill Agar, Alexander Komposch | 2024-09-03 |
| 11936342 | Output-integrated transistor amplifier device packages incorporating internal connections | Marvin Marbell, Jonathan Chang, Haedong Jang, Qianli Mu, Jeremy Fisher +1 more | 2024-03-19 |
| 11552597 | Radio frequency amplifier implementing an input baseband enhancement circuit and a process of implementing the same | Richard Wilson, Marvin Marbell | 2023-01-10 |
| 11004808 | Package with different types of semiconductor dies attached to a flange | Xikun Zhang, Dejiang Chang, Bill Agar, Alexander Komposch | 2021-05-11 |
| 9997476 | Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange | Xikun Zhang, Dejiang Chang, Bill Agar, Alexander Komposch | 2018-06-12 |