Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080660 | Package with different types of semiconductor dies attached to a flange | Xikun Zhang, Bill Agar, Michael Lefevre, Alexander Komposch | 2024-09-03 |
| 11004808 | Package with different types of semiconductor dies attached to a flange | Xikun Zhang, Bill Agar, Michael Lefevre, Alexander Komposch | 2021-05-11 |
| 9997476 | Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange | Xikun Zhang, Bill Agar, Michael Lefevre, Alexander Komposch | 2018-06-12 |