Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12080660 | Package with different types of semiconductor dies attached to a flange | Xikun Zhang, Bill Agar, Michael Lefevre, Alexander Komposch | 2024-09-03 | $15,035,000 |
| 11004808 | Package with different types of semiconductor dies attached to a flange | Xikun Zhang, Bill Agar, Michael Lefevre, Alexander Komposch | 2021-05-11 | $131,603,000 |
| 9997476 | Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange | Xikun Zhang, Bill Agar, Michael Lefevre, Alexander Komposch | 2018-06-12 |