Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468399 | Multi-cavity package having single metal flange | Saurabh Goel, Cynthia Blair, Cristian Gozzi | 2019-11-05 |
| 9997476 | Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange | Xikun Zhang, Dejiang Chang, Bill Agar, Michael Lefevre | 2018-06-12 |
| 9373577 | Hybrid semiconductor package | Brian Condie, Erwin Orejola, Michael Opiz Real | 2016-06-21 |
| 9293407 | Semiconductor package having a baseplate with a die attach region and a peripheral region | Soon Ing Chew, Brian Condie | 2016-03-22 |
| 9209116 | Semiconductor device package having asymmetric chip mounting area and lead widths | Soon Ing Chew, Herman Hugo, Simon Ward | 2015-12-08 |
| 8907467 | PCB based RF-power package window frame | Soon Ing Chew, Brian Condie | 2014-12-09 |
| 8604609 | Flange for semiconductor die | Anwar Mohammed, Soon Ing Chew, Donald Fowlkes, Benjamin P. Law, Michael Opiz Real | 2013-12-10 |
| 8324115 | Semiconductor chip, semiconductor device and methods for producing the same | Ralf Otremba, Daniel Kraft, Hannes Eder, Paul Ganitzer, Stefan Woehlert | 2012-12-04 |
| 8314487 | Flange for semiconductor die | Anwar Mohammed, Soon Ing Chew, Donald Fowlkes, Benjamin P. Law, Michael Opiz Real | 2012-11-20 |
| 8013429 | Air cavity package with copper heat sink and ceramic window frame | Anwar Mohammed, Soon Ing Chew, Christian Andrada | 2011-09-06 |