Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9293407 | Semiconductor package having a baseplate with a die attach region and a peripheral region | Alexander Komposch, Brian Condie | 2016-03-22 |
| 9209116 | Semiconductor device package having asymmetric chip mounting area and lead widths | Alexander Komposch, Herman Hugo, Simon Ward | 2015-12-08 |
| 8907467 | PCB based RF-power package window frame | Alexander Komposch, Brian Condie | 2014-12-09 |
| 8604609 | Flange for semiconductor die | Anwar Mohammed, Donald Fowlkes, Alexander Komposch, Benjamin P. Law, Michael Opiz Real | 2013-12-10 |
| 8314487 | Flange for semiconductor die | Anwar Mohammed, Donald Fowlkes, Alexander Komposch, Benjamin P. Law, Michael Opiz Real | 2012-11-20 |
| 8110445 | High power ceramic on copper package | Anwar Mohammed, Donald Fowlkes | 2012-02-07 |
| 8110915 | Open cavity leadless surface mountable package for high power RF applications | Donald Fowlkes | 2012-02-07 |
| 8013429 | Air cavity package with copper heat sink and ceramic window frame | Anwar Mohammed, Alexander Komposch, Christian Andrada | 2011-09-06 |
| 7811862 | Thermally enhanced electronic package | Anwar A. Mohammad | 2010-10-12 |