Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908823 | Devices incorporating stacked bonds and methods of forming the same | Brian Condie, Ulf Hakan Andre | 2024-02-20 |
| 9373577 | Hybrid semiconductor package | Alexander Komposch, Brian Condie, Michael Opiz Real | 2016-06-21 |