Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-cavity package having single metal flange

Multi-cavity package having single metal flange

US Patent 11437362 · Granted Sep 6, 2022

Estimated economic value: $216,978,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

RF amplifier devices and methods of manufacturing including modularized designs 2025
Semiconductor device packages with exposed heat dissipating surfaces and methods2025
Packaged semiconductor devices with leadframes having tie bar with recessed cavi2025
Thermal and electrical conductivity between metal contacts utilizing spring pin 2025
RF amplifier devices including top side contacts and methods of manufacturing2024
Packaged semiconductor devices, and package molds for forming packaged semicondu2024
Packaged RF power device with PCB routing outside protective member2024
Package with different types of semiconductor dies attached to a flange2024
Contact and die attach metallization for silicon carbide based devices and relat2024
RF amplifiers having shielded transmission line structures2024
Methods of forming packaged semiconductor devices and leadframes for semiconduct2024
Integrated passive device (IPD) components and a package and processes implement2024