Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119239 | Packaged semiconductor devices, and package molds for forming packaged semiconductor devices | Eng Wah Woo, Alexander Komposch, Kok Meng Kam, Samantha Cheang | 2024-10-15 |
| 12009286 | Methods of forming packaged semiconductor devices and leadframes for semiconductor device packages | Eng Wah Woo, Alexander Komposch | 2024-06-11 |
| 10777536 | Semiconductor package with air cavity | Chau Fatt Chiang, April Coleen Tuazon Bernardez, Junny Abdul Wahid, Roslie Saini bin Bakar, Kon Hoe Chin +8 more | 2020-09-15 |