Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406896 | Semiconductor device package having thermal dissipation feature and method therefor | Scott M. Hayes, Michael B. Vincent, Zhiwei Gong, Rushik P. Tank, Kabir Mirpuri | 2025-09-02 |
| 11935809 | Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements | Zhiwei Gong, Scott M. Hayes, Michael B. Vincent, Rushik P. Tank, Kabir Mirpuri | 2024-03-19 |
| 11817366 | Semiconductor device package having thermal dissipation feature and method therefor | Michael B. Vincent, Scott M. Hayes, Zhiwei Gong, Kabir Mirpuri, Rushik P. Tank | 2023-11-14 |
| 11557525 | Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements | Zhiwei Gong, Scott M. Hayes, Michael B. Vincent, Rushik P. Tank, Kabir Mirpuri | 2023-01-17 |
| 11121467 | Semiconductor package with compact antenna formed using three-dimensional additive manufacturing process | Jinbang Tang, Zhiwei Gong, Michael B. Vincent | 2021-09-14 |
| 9054111 | Electronic device and method of packaging an electronic device | Jianwen Xu, Lizabeth Keser, Goerge R. Leal | 2015-06-09 |
| 7989951 | Die assemblies | David J. Dougherty | 2011-08-02 |
| 7950144 | Method for controlling warpage in redistributed chip packaging panels | Lakshmi N. Ramanathan, George R. Leal, Douglas G. Mitchell | 2011-05-31 |